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DM54LS283J

Texas Instruments

DM54LS283J by Texas Instruments

DM54LS283J by Texas Instruments is a 16-terminal TTL digital arithmetic circuit with a supply voltage of 5V. Its ceramic rectangular package can operate in temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring reliable performance in harsh environments. The through-hole terminals and MIL-STD design ensure robust connectivity and durability.

Median Price

$16.132

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 3 parts In-Stock

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$15.464

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$15.464

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$15.464

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Bristol Electronics

USA . 88 parts In-Stock

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$16.800

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$15.506

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Vyrian

USA . 4,179 parts In-Stock

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Digiode

USA . 4,101 parts In-Stock

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Anansix

USA . 881 parts In-Stock

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Microfarads

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Electronic Expediters

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 5,830 parts In-Stock

1+ parts

$4.313

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$4.141

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$4.141

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$4.141

$4.141

AZTECH Wire

Italy . 424 parts In-Stock

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$5.410

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Parana Technologies

USA . 214 parts In-Stock

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$10.113

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$939.152

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$9.102

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DigiPath Technology Company

USA . 290 parts In-Stock

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$11.136

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$10.245

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ChromeModa Solutions

Germany . 6,224 parts In-Stock

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$11.363

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$9.318

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

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$11.363

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$10.795

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$10.227

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One Stop Electronics

USA . 940 parts In-Stock

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$15.000

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$15.000

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$33.391

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$33.057

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$31.721

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Corphita

USA . 3,588 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Northwest PG Solutions

USA . 2,093 parts In-Stock

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Supply Digital

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Native Components

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Overview

Upgrade your digital arithmetic circuits with the Texas Instruments DM54LS283J. Known for their high-quality manufacturing, Texas Instruments brings you a reliable and efficient solution for your electronic projects. Perfect for military-grade applications, this rectangular-shaped ceramic package offers a nominal supply voltage of 5V and can operate in extreme temperatures from -55°C to 125°C. With 16 terminals and TTL technology, this product provides exceptional performance and value for all your digital arithmetic needs. Trust Texas Instruments to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, allowing for efficient heat dissipation and ensuring reliable performance in high-temperature environments.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate this circuit into existing systems or circuit boards, saving space and enabling a more compact design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V makes it compatible with a wide range of existing systems and power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this circuit can withstand high temperatures without compromising its performance or reliability.

Technology: TTL

Using TTL technology ensures high-speed operation and low power consumption, making it ideal for applications where speed and efficiency are critical.

Technical Specifications

Digital Arithmetic Circuits DM54LS283J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM54LS283J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-287-8532, 5962012878532, 5962-01-129-3234, 5962011293234, 5962-99-733-2465, 5962997332465

NIIN

012878532, 011293234, 997332465

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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