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DM54LS85J

Texas Instruments

DM54LS85J by Texas Instruments

The Texas Instruments DM54LS85J is a digital arithmetic circuit with 16 terminals, operating at a supply voltage of 5V. Its ceramic rectangular package style makes it suitable for military-grade applications, with an extended temperature range from -55°C to 125°C. Ideal for high-reliability systems requiring precise arithmetic functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,167 parts In-Stock

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Digiode

USA . 3,785 parts In-Stock

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Anansix

USA . 2,890 parts In-Stock

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Electronic Expediters

USA . 36 parts In-Stock

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Beltway Electronics Company

USA . 12 parts In-Stock

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Resion

USA . 7 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 821 parts In-Stock

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$19.508

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$19.508

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One Stop Electronics

USA . 795 parts In-Stock

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$21.000

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795

$21.000

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Parana Technologies

USA . 43 parts In-Stock

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$27.661

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$38.547

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DigiPath Technology Company

USA . 1,841 parts In-Stock

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$30.458

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$28.022

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ChromeModa Solutions

Germany . 4,060 parts In-Stock

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$31.080

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$25.486

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$31.080

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IDEA Electronic Components Group

UK . 1,878 parts In-Stock

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$31.080

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$29.526

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$27.972

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Andel Nordic

Denmark . 4,763 parts In-Stock

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$54.440

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$38.109

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Native Components

USA . 828 parts In-Stock

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$510.723

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$500.509

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$495.401

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$490.294

828

$510.723

$500.509

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$490.294

Northwest PG Solutions

USA . 1,375 parts In-Stock

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$561.795

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Corphita

USA . 3,041 parts In-Stock

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Supply Digital

USA . 2,811 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the DM54LS85J digital arithmetic circuit. This high-performance component offers unparalleled precision and efficiency, making it ideal for a wide range of applications. Whether you're working on military-grade projects or industrial automation systems, this product ensures seamless operation and accurate calculations. Trust in Texas Instruments for superior technology that provides value and benefits to satisfy all your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic offers excellent thermal conductivity and low coefficient of expansion, making it ideal for high-temperature environments and providing good mechanical stability for the circuit.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V simplifies power supply requirements and compatibility with standard electronic systems.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high heat environments reliably.

Temperature Grade: MILITARY

Being rated for military-grade temperature specifications indicates high reliability and durability, suitable for demanding applications.

Technical Specifications

Digital Arithmetic Circuits DM54LS85J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DM54LS85J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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