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SN74HC280D3

Texas Instruments

SN74HC280D3 by Texas Instruments

SN74HC280D3 by Texas Instruments is a CMOS digital arithmetic circuit with 14 terminals. It operates b/w -40°C to 85°C, suitable for industrial applications. This surface-mount IC has a power supply range of 2-6V and comes in a small outline rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,496 parts In-Stock

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Digiode

USA . 2,162 parts In-Stock

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2,162

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Distributors (Availability)

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Andel Nordic

Denmark . 3,112 parts In-Stock

1+ parts

$1.427

100+ parts

-

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$1.370

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$1.370

3,112

$1.427

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$1.370

$1.370

One Stop Electronics

USA . 955 parts In-Stock

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$7.000

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955

$7.000

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AZTECH Wire

Italy . 230 parts In-Stock

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$8.607

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230

$8.607

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Parana Technologies

USA . 752 parts In-Stock

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$26.552

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$27.121

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752

$26.552

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$27.121

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DigiPath Technology Company

USA . 1,093 parts In-Stock

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$29.237

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$26.898

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1,093

$29.237

$26.898

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ChromeModa Solutions

Germany . 5,726 parts In-Stock

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$29.834

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$24.464

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5,726

$29.834

$24.464

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IDEA Electronic Components Group

UK . 1,706 parts In-Stock

1+ parts

$29.834

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$28.342

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$26.851

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1,706

$29.834

$28.342

$26.851

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Corphita

USA . 2,712 parts In-Stock

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2,712

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Overview

Upgrade your digital arithmetic circuits with the high-quality SN74HC280D3 by Texas Instruments. Known for their reliability and precision, Texas Instruments delivers top-notch products that exceed industry standards. This versatile component is ideal for a wide range of applications, offering customers superior performance and efficiency. Experience the value and benefits of Texas Instruments' innovative technology with the SN74HC280D3, designed to meet your digital arithmetic circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to external elements, making the product long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular package shape enables easier placement and alignment on the circuit board, optimizing space usage.

Power Supplies (V): 2/6

Support for multiple power supply voltages (2V and 6V) offers flexibility in designing circuits for different voltage requirements.

No. of Terminals: 14

Higher number of terminals allows for more connections and functionalities, enhancing the versatility of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability of the product under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in a wide range of environments, including extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improves signal integrity, reducing the risk of connection failure.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates that the product is designed to withstand harsh industrial environments, ensuring reliability in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form allows for easy surface mounting and soldering, simplifying the assembly process.

Terminal Pitch: 1.27 mm

Narrow terminal pitch provides high-density connections, allowing for more terminals in a smaller space and better signal performance.

Technical Specifications

Digital Arithmetic Circuits SN74HC280D3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

2/6

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC280D3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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