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SN74ALS689N-10

Texas Instruments

SN74ALS689N-10 by Texas Instruments

SN74ALS689N-10 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 23ns. It features open-collector outputs, operates b/w 0 to 70°C, and has a package style of in-line. Ideal for applications requiring fast arithmetic operations in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,996 parts In-Stock

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8,996

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Digiode

USA . 892 parts In-Stock

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892

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Distributors (Availability)

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Andel Nordic

Denmark . 3,102 parts In-Stock

1+ parts

$8.051

100+ parts

-

1k+ parts

$7.729

10k+ parts

$7.729

3,102

$8.051

-

$7.729

$7.729

AZTECH Wire

Italy . 328 parts In-Stock

1+ parts

$17.560

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328

$17.560

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Parana Technologies

USA . 1,988 parts In-Stock

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$23.587

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$24.219

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1,988

$23.587

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$24.219

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DigiPath Technology Company

USA . 2,310 parts In-Stock

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$25.972

100+ parts

$23.894

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2,310

$25.972

$23.894

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ChromeModa Solutions

Germany . 2,721 parts In-Stock

1+ parts

$26.502

100+ parts

$21.732

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2,721

$26.502

$21.732

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IDEA Electronic Components Group

UK . 1,086 parts In-Stock

1+ parts

$26.502

100+ parts

$25.177

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$23.852

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1,086

$26.502

$25.177

$23.852

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One Stop Electronics

USA . 484 parts In-Stock

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$44.000

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484

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Corphita

USA . 4,299 parts In-Stock

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4,299

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Overview

Enhance your digital arithmetic circuits with the high-quality SN74ALS689N-10 by Texas Instruments. Designed to meet the demands of various applications, this product offers unparalleled value and benefits to customers. With a reputable manufacturer like Texas Instruments behind it, you can trust in the reliability and performance of this product. Upgrade your projects with ease and efficiency using this top-of-the-line digital arithmetic circuit.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the circuitry inside, ensuring longevity and reliability.

No. of Bits: 8

Offers a high level of precision and accuracy in arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage that is easily accessible and compatible with most power sources.

Propagation Delay (tpd): 23 ns

Low propagation delay ensures fast processing speed, making this product suitable for real-time applications.

Technology: TTL

TTL technology provides high-speed operation and compatibility with other TTL devices.

Maximum Operating Temperature: 70 °C

High operating temperature range allows for reliable operation in various environments.

Output Characteristics: OPEN-COLLECTOR

Open-collector output allows for flexible interfacing with other digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN74ALS689N-10 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

ALS

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay (tpd):

23 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74ALS689N-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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