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SNC5483AJ

Texas Instruments

SNC5483AJ by Texas Instruments

SNC5483AJ by Texas Instruments is a 4-bit digital arithmetic circuit with MIL-STD-883 Class B screening. It operates at a supply voltage of 5V, has a propagation delay of 24ns, and can withstand temperatures from -55 to 125°C. Ideal for military applications requiring high reliability and precision calculations in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,842 parts In-Stock

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Digiode

USA . 3,410 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 70 parts In-Stock

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70

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Manoshevitz Elec. Sales

Israel . 12 parts In-Stock

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Resion

USA . 8 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Andel Nordic

Denmark . 846 parts In-Stock

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$1.964

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$1.885

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$1.885

846

$1.964

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$1.885

$1.885

AZTECH Wire

Italy . 879 parts In-Stock

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$9.034

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879

$9.034

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Parana Technologies

USA . 1,390 parts In-Stock

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$18.524

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$1,720.277

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$16.672

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DigiPath Technology Company

USA . 221 parts In-Stock

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$20.398

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$18.766

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IDEA Electronic Components Group

UK . 1,056 parts In-Stock

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$20.814

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$19.773

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$18.733

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ChromeModa Solutions

Germany . 231 parts In-Stock

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$20.814

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$17.067

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One Stop Electronics

USA . 582 parts In-Stock

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$61.000

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Corphita

USA . 4,728 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SNC5483AJ. Known for their superior quality and reliability, Texas Instruments is a trusted manufacturer in the industry. Ideal for military-grade applications, this product offers fast propagation delay and precise calculations, making it perfect for demanding environments. Experience the exceptional value and benefits of the SNC5483AJ, providing customers with high performance and efficiency for all their digital arithmetic needs. Trust in Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material is durable and provides good thermal conductivity, ensuring reliable operation of the digital arithmetic circuit.

No. of Bits: 4

This digital arithmetic circuit has 4 bits, making it suitable for basic arithmetic operations in various electronic devices.

Nominal Supply Voltage / Vsup (V): 5

Operating at a supply voltage of 5V makes this circuit compatible with standard power sources, making it easy to integrate into existing systems.

Propagation Delay (tpd): 24 ns

With a low propagation delay, this circuit can quickly process arithmetic operations, making it ideal for applications where speed is critical.

Minimum Operating Temperature: -55 °C

This circuit can operate at very low temperatures, making it suitable for use in harsh environments or applications that require reliability in extreme conditions.

Technical Specifications

Digital Arithmetic Circuits SNC5483AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

FULL ADDER; WITH INTERNAL CARRY LOOKAHEAD; CENTER VCC AND GND; PERMITS RIPPLE CARRY CASCADING

Family:

TTL/H/L

JESD-30 Code:

R-CDIP-T16

Length:

19.56 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SNC5483AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-350-1475, 5962003501475

NIIN

003501475

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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