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SN74S181JP4

Texas Instruments

SN74S181JP4 by Texas Instruments

SN74S181JP4 by Texas Instruments is a TTL digital arithmetic circuit with 24 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, suitable for commercial applications requiring dual terminal positions. With a terminal pitch of 2.54mm, it offers precise calculations in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,257 parts In-Stock

1+ parts

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4,257

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Digiode

USA . 3,514 parts In-Stock

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3,514

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,884 parts In-Stock

1+ parts

$2.918

100+ parts

-

1k+ parts

$2.801

10k+ parts

$2.801

3,884

$2.918

-

$2.801

$2.801

AZTECH Wire

Italy . 364 parts In-Stock

1+ parts

$5.498

100+ parts

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364

$5.498

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One Stop Electronics

USA . 1,016 parts In-Stock

1+ parts

$12.000

100+ parts

-

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1,016

$12.000

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Parana Technologies

USA . 315 parts In-Stock

1+ parts

$20.513

100+ parts

-

1k+ parts

$20.580

10k+ parts

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315

$20.513

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$20.580

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DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$22.587

100+ parts

-

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369

$22.587

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ChromeModa Solutions

Germany . 4,305 parts In-Stock

1+ parts

$23.048

100+ parts

$18.899

1k+ parts

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4,305

$23.048

$18.899

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$23.048

100+ parts

$21.896

1k+ parts

$20.743

10k+ parts

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1,269

$23.048

$21.896

$20.743

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Corphita

USA . 3,903 parts In-Stock

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3,903

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Overview

Upgrade your digital arithmetic circuits with the SN74S181JP4 by Texas Instruments. This high-quality product offers unmatched reliability and performance, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this component provides customers with exceptional value and benefits. Experience seamless operation and enhanced efficiency with the SN74S181JP4, setting a new standard in digital arithmetic circuits.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity, durability, and resistance to high temperatures, making it suitable for efficient heat dissipation in the circuit.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within circuit layouts or on PCBs, optimizing space utilization and facilitating assembly.

No. of Terminals: 24

Having 24 terminals provides versatility and flexibility in connectivity options, enabling the circuit to interface with multiple input/output devices or subsystems.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and streamlined design for seamless integration into existing circuit configurations, reducing overall footprint and improving signal transmission efficiency.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70 °C, this circuit can withstand elevated thermal conditions without performance degradation, ensuring reliable operation in various industrial environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows the circuit to function effectively in cold climates or refrigerated environments, offering consistent performance across a wide temperature range.

Terminal Position: DUAL

Dual terminal position enhances signal integrity and reduces cross-talk or interference between adjacent terminals, promoting stable and accurate data transmission within the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that the circuit is designed for standard commercial applications, providing a cost-effective solution for general-purpose digital arithmetic tasks in various electronic devices or systems.

Technology: TTL

TTL (Transistor-Transistor Logic) technology offers fast switching speeds, low power consumption, and compatibility with a wide range of applications, making it suitable for high-speed arithmetic operations in digital circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and reliable solder connections, providing mechanical stability and resistance to vibration or mechanical stress, ensuring long-term durability in challenging operating conditions.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this circuit can easily interface with standard PCB layouts or breadboard configurations, simplifying installation and connection processes for seamless integration into electronic projects.

Technical Specifications

Digital Arithmetic Circuits SN74S181JP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S181JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-054-4379, 5962010544379

NIIN

010544379

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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