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SNJ54HC682WR

Texas Instruments

SNJ54HC682WR by Texas Instruments

SNJ54HC682WR by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It features a propagation delay of 413ns and operates in temperatures ranging from -55 to 125°C. This CMOS technology component is ideal for military applications requiring high-speed arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,049 parts In-Stock

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4,049

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Vyrian

USA . 2,467 parts In-Stock

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2,467

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Distributors (Availability)

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Andel Nordic

Denmark . 4,502 parts In-Stock

1+ parts

$3.597

100+ parts

-

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$3.453

10k+ parts

$3.453

4,502

$3.597

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$3.453

$3.453

AZTECH Wire

Italy . 838 parts In-Stock

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$17.768

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838

$17.768

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Parana Technologies

USA . 1,776 parts In-Stock

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$21.626

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$2,008.312

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$19.463

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1,776

$21.626

$2,008.312

$19.463

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DigiPath Technology Company

USA . 1,280 parts In-Stock

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$23.813

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1,280

$23.813

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ChromeModa Solutions

Germany . 4,605 parts In-Stock

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$24.299

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$19.925

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$24.299

$19.925

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IDEA Electronic Components Group

UK . 504 parts In-Stock

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$24.299

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$23.084

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$21.869

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504

$24.299

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$21.869

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One Stop Electronics

USA . 1,288 parts In-Stock

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$49.000

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Corphita

USA . 1,560 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SNJ54HC682WR from Texas Instruments. As a leader in digital arithmetic circuits, Texas Instruments delivers top-quality products designed for military-grade applications. With a package body material of ceramic and glass-sealed construction, this product ensures reliability and durability in extreme conditions. Whether you're working on aerospace systems or industrial machinery, the SNJ54HC682WR offers unmatched performance and precision. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability to ensure long-lasting performance.

No. of Bits: 8

Offers a sufficient number of bits for various arithmetic calculations and processing.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage, ensuring compatibility with most systems.

Propagation Delay (tpd): 413 ns

Provides fast processing speed for quick arithmetic operations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.

Technical Specifications

Digital Arithmetic Circuits SNJ54HC682WR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH PULL-UP RESISTORS ON B INPUTS; WITH A = B & A > B OUTPUTS

Family:

HC/UH

JESD-30 Code:

R-GDFP-F20

Length:

13.09 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Propagation Delay (tpd):

413 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.45 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.92 mm

Trade Compliance

SNJ54HC682WR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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