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SNJ54181W-00

Texas Instruments

SNJ54181W-00 by Texas Instruments

SNJ54181W-00 by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 50ns, making it ideal for military-grade applications requiring fast calculations in harsh environments. This rectangular flatpack package with dual terminals can handle temperatures from -55°C to 125°C, suitable for various rugged electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,047 parts In-Stock

1+ parts

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3,047

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Digiode

USA . 2,892 parts In-Stock

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2,892

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 150 parts In-Stock

1+ parts

$3.016

100+ parts

-

1k+ parts

$2.895

10k+ parts

$2.895

150

$3.016

-

$2.895

$2.895

AZTECH Wire

Italy . 602 parts In-Stock

1+ parts

$6.671

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602

$6.671

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Parana Technologies

USA . 1,415 parts In-Stock

1+ parts

$16.937

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$17.170

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1,415

$16.937

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$17.170

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DigiPath Technology Company

USA . 1,045 parts In-Stock

1+ parts

$18.649

100+ parts

$17.157

1k+ parts

-

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1,045

$18.649

$17.157

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ChromeModa Solutions

Germany . 2,420 parts In-Stock

1+ parts

$19.030

100+ parts

$15.605

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2,420

$19.030

$15.605

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IDEA Electronic Components Group

UK . 1,229 parts In-Stock

1+ parts

$19.030

100+ parts

$18.078

1k+ parts

$17.127

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1,229

$19.030

$18.078

$17.127

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One Stop Electronics

USA . 504 parts In-Stock

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$63.000

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504

$63.000

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Corphita

USA . 2,231 parts In-Stock

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2,231

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Overview

Unlock the power of digital arithmetic circuits with the SNJ54181W-00 by Texas Instruments. Crafted with precision and expertise, this product offers unmatched quality and reliability. Ideal for military-grade applications, this flatpack package delivers fast propagation delays and operates in extreme temperatures. Experience the seamless performance and efficiency of this 4-bit circuit, designed to meet your highest standards. Elevate your projects with the superior value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan of the product.

No. of Bits: 4

Provides the ability to process data and perform arithmetic operations with a higher level of precision.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard voltage level, ensuring compatibility with most power sources.

Propagation Delay (tpd): 50 ns

This fast propagation delay ensures quick processing of data, making it suitable for real-time applications.

Technology: TTL

TTL technology ensures reliable and high-speed performance, making it ideal for various digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SNJ54181W-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F24

Length:

14.36 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

135 mA

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.29 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

9.09 mm

Trade Compliance

SNJ54181W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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