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TPM4582AN

Texas Instruments

TPM4582AN by Texas Instruments

TPM4582AN by Texas Instruments is a CMOS digital arithmetic circuit with 16 terminals. It operates in industrial temperature range (-40 to 85°C) and has a rectangular package style. Ideal for applications requiring precise calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,907 parts In-Stock

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Digiode

USA . 2,923 parts In-Stock

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2,923

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Distributors (Availability)

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AZTECH Wire

Italy . 862 parts In-Stock

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$17.893

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862

$17.893

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Parana Technologies

USA . 789 parts In-Stock

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$29.713

100+ parts

$2,759.270

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$26.741

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789

$29.713

$2,759.270

$26.741

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DigiPath Technology Company

USA . 383 parts In-Stock

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$32.717

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$30.100

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383

$32.717

$30.100

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ChromeModa Solutions

Germany . 3,555 parts In-Stock

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$33.385

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$27.376

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3,555

$33.385

$27.376

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IDEA Electronic Components Group

UK . 209 parts In-Stock

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$33.385

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$31.716

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$30.046

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209

$33.385

$31.716

$30.046

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One Stop Electronics

USA . 507 parts In-Stock

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$64.000

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507

$64.000

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Corphita

USA . 2,299 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the TPM4582AN from Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability. This product is perfect for a wide range of applications and offers unmatched value to customers. With its advanced technology and industrial-grade temperature grade, the TPM4582AN provides superior performance and efficiency. Upgrade your circuit designs today with this high-quality component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection to the internal components of the circuit, ensuring a longer lifespan for the product.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices and circuit designs, providing flexibility in usage.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and inputs, increasing the versatility of the circuit in various applications.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient for installation and maintenance, especially in situations where space is limited.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this circuit can operate efficiently even in harsh environments without overheating or performance degradation.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the circuit can function in extreme cold conditions without issues, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal positions provide redundancy and backup in case one terminal fails, enhancing the reliability and robustness of the circuit.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that the circuit can withstand the temperature fluctuations and demands of industrial applications, making it a reliable choice for such environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a cost-effective and versatile choice for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ideal for applications where vibration and mechanical stress are a concern, ensuring stable operation of the circuit.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy soldering and connection of external components, simplifying the assembly process and making it user-friendly for circuit designers and technicians.

Technical Specifications

Digital Arithmetic Circuits TPM4582AN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TPM4582AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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