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CD54HC280F3A

Texas Instruments

CD54HC280F3A by Texas Instruments

CD54HC280F3A by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 43ns at 4.5V. It operates in temperatures ranging from -55 to 125°C and has a max power supply current of 0.08mA. Ideal for military applications due to its MIL-Grade technology and through-hole terminal form.

Median Price

$17.162

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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$17.162

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Vyrian

USA . 7,803 parts In-Stock

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Digiode

USA . 743 parts In-Stock

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ComSIT Distribution GmbH

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Elcom Components

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Mil-Aero Solutions, Inc.

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Andel Nordic

Denmark . 3,349 parts In-Stock

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$4.965

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$4.767

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$4.767

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$4.767

AZTECH Wire

Italy . 790 parts In-Stock

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$9.648

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Native Components

USA . 563 parts In-Stock

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$10.240

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Northwest PG Solutions

USA . 892 parts In-Stock

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$11.264

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$10.138

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Parana Technologies

USA . 2,210 parts In-Stock

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$27.829

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$2,584.383

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$25.046

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DigiPath Technology Company

USA . 1,097 parts In-Stock

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$30.644

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IDEA Electronic Components Group

UK . 1,876 parts In-Stock

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$31.269

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$29.706

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$28.142

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ChromeModa Solutions

Germany . 1,114 parts In-Stock

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$25.641

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One Stop Electronics

USA . 1,440 parts In-Stock

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$54.000

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

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Microchip USA

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Supply Digital

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Overview

Unlock the power of precision with the CD54HC280F3A by Texas Instruments. Crafted with high-quality materials and cutting-edge technology, this digital arithmetic circuit offers unparalleled performance and reliability. Whether you're designing advanced electronics or tackling complex computations, this product delivers seamless functionality and efficiency. Trust in Texas Instruments to provide top-notch solutions for your technical needs. Elevate your projects with the CD54HC280F3A and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed package body material ensures durability and protection for the internal components, making it suitable for harsh operating environments.

Propagation Delay At Nominal Supply: 43 ns

The low propagation delay at nominal supply voltage ensures fast processing speeds, making it ideal for applications that require quick calculations.

No. of Bits: 9

The 9 bits provide a higher resolution for arithmetic calculations, allowing for more precise results in digital operations.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V nominal supply voltage provides a stable power source for the circuit, ensuring reliable performance and accuracy in calculations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows for operation in extreme conditions without compromising the circuit's functionality.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and a wide supply voltage range, making it energy-efficient and reliable for digital arithmetic applications.

Technical Specifications

Digital Arithmetic Circuits CD54HC280F3A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

HC/UH

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD54HC280F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-264-9055, 5962012649055

NIIN

012649055

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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