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CD54HCT283F3A

Texas Instruments

CD54HCT283F3A by Texas Instruments

CD54HCT283F3A by Texas Instruments is a 4-bit digital arithmetic circuit with 60ns propagation delay at 5V. It operates in military-grade temperature range (-55 to 125 °C) and has a max power supply current of 0.08mA. Ideal for applications requiring fast arithmetic calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 3,950 parts In-Stock

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Digiode

USA . 3,550 parts In-Stock

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LWI Electronics Inc

India . 138 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 38 parts In-Stock

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Bristol Electronics

USA . 38 parts In-Stock

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Dan-Mar Components

USA . 38 parts In-Stock

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Speed Components Ltd

Israel . 5 parts In-Stock

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Sunrise Surplus Inc.

USA . 4 parts In-Stock

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AZTECH Wire

Italy . 670 parts In-Stock

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$8.993

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Advanced Electronics

New Zealand . 750 parts In-Stock

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$17.114

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$15.574

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$14.033

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Parana Technologies

USA . 787 parts In-Stock

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$27.144

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$32.694

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DigiPath Technology Company

USA . 813 parts In-Stock

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$29.889

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$27.498

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ChromeModa Solutions

Germany . 6,247 parts In-Stock

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$30.499

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

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Corohmni

South Africa . 568 parts In-Stock

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One Stop Electronics

USA . 471 parts In-Stock

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$39.000

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Native Components

USA . 325 parts In-Stock

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$104.620

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$100.435

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Northwest PG Solutions

USA . 2,171 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Supply Digital

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Microchip USA

USA . 1,461 parts In-Stock

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Corphita

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Overview

Unlock the power of precision and reliability with the Texas Instruments CD54HCT283F3A digital arithmetic circuit. Manufactured with top-quality materials and cutting-edge technology, this product offers unparalleled performance in a wide range of applications. From industrial automation to telecommunications, this versatile component delivers fast propagation delays and low power consumption, making it a valuable asset for any project. Trust Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This feature provides durability and reliability to the product, making it suitable for harsh environments or high temperature applications.

Propagation Delay At Nominal Supply: 60 ns

With a low propagation delay, this product ensures fast processing of arithmetic calculations, making it efficient for real-time applications.

No. of Bits: 4

Having 4 bits allows for complex arithmetic operations to be performed accurately and efficiently, making this product suitable for advanced computing tasks.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage ensures compatibility with a wide range of electronic systems, making this product versatile in its application.

Maximum Operating Temperature: 125°C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, making it suitable for industrial and military applications.

Technical Specifications

Digital Arithmetic Circuits CD54HCT283F3A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH FULL INTERNAL LOOKAHEAD

Family:

HCT

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

60 ns

Propagation Delay (tpd):

74 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD54HCT283F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-307-0951, 5962013070951

NIIN

013070951

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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