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CD54AC280F3A

Texas Instruments

CD54AC280F3A by Texas Instruments

CD54AC280F3A by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 19.1 ns at 3.3V, suitable for military applications. It features a max operating temperature of 125°C and offers complementary output polarity, making it ideal for high-performance computing systems.

Median Price

$20.968

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 6 parts In-Stock

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$20.470

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$20.470

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Avnet

USA . 16 parts In-Stock

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$21.466

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$20.874

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$21.466

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Distributors (In-Stock)

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Digiode

USA . 315 parts In-Stock

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$19.446

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$19.446

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Vyrian

USA . 7,301 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 48 parts In-Stock

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ECAB

Sweden . 7 parts In-Stock

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,954 parts In-Stock

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$2.651

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Corphita

USA . 3,776 parts In-Stock

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$18.423

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Parana Technologies

USA . 1,107 parts In-Stock

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$26.911

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$29.965

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$26.911

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$29.965

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DigiPath Technology Company

USA . 332 parts In-Stock

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$29.632

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$27.262

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332

$29.632

$27.262

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ChromeModa Solutions

Germany . 4,588 parts In-Stock

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$30.237

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$24.794

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IDEA Electronic Components Group

UK . 1,317 parts In-Stock

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$30.237

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$28.725

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$27.213

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Andel Nordic

Denmark . 5,423 parts In-Stock

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$36.270

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$25.392

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$25.392

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$25.392

Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 2,642 parts In-Stock

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Supply Digital

USA . 1,118 parts In-Stock

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Native Components

USA . 585 parts In-Stock

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$2.338

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585

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Overview

Enhance your digital arithmetic circuits with the Texas Instruments CD54AC280F3A, a top-quality product designed for high-performance applications. Manufactured by the industry leader, Texas Instruments, this ceramic, glass-sealed package offers unparalleled reliability and precision. With a fast propagation delay of 19.1 ns and 9 bits, this component is ideal for a wide range of military-grade projects. Trust in Texas Instruments for cutting-edge technology that delivers exceptional value and performance for all your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material provides durability and protection for the internal components, ensuring long-term performance and reliability.

Propagation Delay At Nominal Supply: 19.1 ns

The low propagation delay ensures fast and efficient processing of digital signals, making this circuit ideal for time-sensitive applications.

No. of Bits: 9

With 9 bits, this digital arithmetic circuit offers high precision and accuracy in calculations, making it suitable for complex computational tasks.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V allows for efficient power consumption while still providing enough power for reliable operation.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this circuit can withstand demanding environmental conditions without affecting performance.

Technology: CMOS

The CMOS technology used in this circuit offers low power consumption and high noise immunity, enhancing overall efficiency and reliability.

Technical Specifications

Digital Arithmetic Circuits CD54AC280F3A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

AC

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

75 Amp

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

1.8/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

19.1 ns

Propagation Delay (tpd):

263 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuit

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54AC280F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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