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CD54HC688

Texas Instruments

CD54HC688 by Texas Instruments

CD54HC688 by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 255 ns. It operates in temperatures ranging from -55°C to 125°C, making it suitable for military-grade applications. This CMOS technology chip has a surface-mount package style and inverted output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,589 parts In-Stock

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Vyrian

USA . 2,145 parts In-Stock

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Native Components

USA . 141 parts In-Stock

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$0.157

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$0.151

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$0.157

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$0.151

Northwest PG Solutions

USA . 73 parts In-Stock

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$0.173

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$0.152

73

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$0.152

AZTECH Wire

Italy . 813 parts In-Stock

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$12.233

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813

$12.233

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Parana Technologies

USA . 2,050 parts In-Stock

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$26.834

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$29.039

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$26.834

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$29.039

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ChromeModa Solutions

Germany . 5,767 parts In-Stock

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$30.151

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$24.724

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$24.724

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

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$30.151

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$28.643

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$27.136

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One Stop Electronics

USA . 1,556 parts In-Stock

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$48.000

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Andel Nordic

Denmark . 5,429 parts In-Stock

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$50.710

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$35.496

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$35.496

5,429

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$35.496

DigiPath Technology Company

USA . 1,294 parts In-Stock

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$27.184

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Corphita

USA . 1,115 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the Texas Instruments CD54HC688! Crafted with precision and expertise, this high-quality product offers customers unmatched performance and reliability. Ideal for a wide range of applications, this chip boasts a quick propagation delay and operates in extreme temperature conditions. With a compact surface-mount design and inverted output polarity, the CD54HC688 provides value and efficiency like no other. Upgrade your projects today with this top-of-the-line solution from Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy mounting on printed circuit boards, making it convenient for integration into various electronic devices.

No. of Bits: 8

With 8 bits, this product can handle a wide range of digital arithmetic operations and calculations with a high level of precision.

Package Style (Meter): UNCASED CHIP

The uncased chip package style provides flexibility in design and integration, allowing for customization and optimization of the final product.

Propagation Delay (tpd): 255 ns

The low propagation delay ensures fast and efficient operation of the digital arithmetic circuits, making it suitable for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliability and stability in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range makes this product suitable for use in both extreme cold and hot environments.

Output Polarity: INVERTED

The inverted output polarity provides flexibility in interfacing with other digital circuits and devices, enhancing compatibility.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement allows for efficient power consumption and operation, making it suitable for battery-powered devices.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Maximum Supply Voltage (Vsup): 6 V

The maximum supply voltage tolerance ensures safe operation and protection against overvoltage conditions, enhancing the reliability of the product.

Technical Specifications

Digital Arithmetic Circuits CD54HC688 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

HC/UH

JESD-30 Code:

X-XUUC-N20

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD54HC688 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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