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SN74AS1181DW3

Texas Instruments

SN74AS1181DW3 by Texas Instruments

SN74AS1181DW3 by Texas Instruments is a TTL technology digital arithmetic circuit with 24 terminals in a small outline package. Operating temperature range from 0°C to 70°C, suitable for commercial applications requiring surface mount components. Ideal for compact electronic devices needing high-speed arithmetic processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,565 parts In-Stock

1+ parts

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5,565

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Digiode

USA . 2,004 parts In-Stock

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2,004

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,224 parts In-Stock

1+ parts

$4.143

100+ parts

-

1k+ parts

$3.978

10k+ parts

$3.978

4,224

$4.143

-

$3.978

$3.978

AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$15.318

100+ parts

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786

$15.318

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Parana Technologies

USA . 2,010 parts In-Stock

1+ parts

$21.474

100+ parts

-

1k+ parts

$21.852

10k+ parts

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2,010

$21.474

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$21.852

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DigiPath Technology Company

USA . 590 parts In-Stock

1+ parts

$23.645

100+ parts

-

1k+ parts

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590

$23.645

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ChromeModa Solutions

Germany . 3,993 parts In-Stock

1+ parts

$24.128

100+ parts

$19.785

1k+ parts

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10k+ parts

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3,993

$24.128

$19.785

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

1+ parts

$24.128

100+ parts

$22.922

1k+ parts

$21.715

10k+ parts

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1,606

$24.128

$22.922

$21.715

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One Stop Electronics

USA . 861 parts In-Stock

1+ parts

$60.000

100+ parts

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861

$60.000

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Corphita

USA . 625 parts In-Stock

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625

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Overview

Unlock the power of digital arithmetic circuits with the Texas Instruments SN74AS1181DW3. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this product offers unmatched performance and efficiency. Whether you're designing a new project or upgrading an existing system, trust in the value and benefits that the SN74AS1181DW3 brings to the table. Experience the advantage of Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protects the internal circuitry from external elements, making this product suitable for long-term use in various environments.

Surface Mount: YES

Surface mount technology makes installation and soldering easier, resulting in a more streamlined manufacturing process and potentially reducing overall costs.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards, maximizing the number of components that can be placed in a compact area.

No. of Terminals: 24

Having 24 terminals provides flexibility for connecting to other components and allows for more complex circuit designs to be implemented.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated temperatures without compromising performance, making it suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that this product can operate reliably even in colder environments, making it versatile and reliable in various conditions.

Terminal Position: DUAL

Dual terminal position allows for efficient signal transmission and connectivity, enabling stable and consistent performance in the circuit.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product meets industry standards for reliable performance in typical commercial applications, ensuring consistent operation in everyday use.

Technology: TTL

TTL technology offers fast signal processing and low power consumption, making this product suitable for high-speed arithmetic operations and energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering, enhancing the overall reliability and robustness of the product in demanding environments.

Terminal Pitch: 1.27 mm

With a small terminal pitch of 1.27mm, this product allows for high-density mounting on circuit boards, enabling compact and space-efficient designs for electronic systems.

Technical Specifications

Digital Arithmetic Circuits SN74AS1181DW3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS1181DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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