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CD54HCT688F3A

Texas Instruments

CD54HCT688F3A by Texas Instruments

CD54HCT688F3A by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 42 ns at 5V. It operates in a temperature range from -55°C to 125°C and has a max power supply current of 0.08 mA. This component is ideal for military-grade applications requiring high-speed data processing.

Median Price

$18.000

Lifecycle Status

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Bristol Electronics

USA . 23 parts In-Stock

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Vyrian

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Digiode

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Resion

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Electronic Expediters

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Electronics Depot

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ACDS - Activité Composants Distribution Service

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Manoshevitz Elec. Sales

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LWI Electronics Inc

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Mil-Aero Solutions, Inc.

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Native Components

USA . 287 parts In-Stock

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Northwest PG Solutions

USA . 1,280 parts In-Stock

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Andel Nordic

Denmark . 731 parts In-Stock

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AZTECH Wire

Italy . 386 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 41 parts In-Stock

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ChromeModa Solutions

Germany . 2,174 parts In-Stock

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IDEA Electronic Components Group

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One Stop Electronics

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Authorized Procurement Solutions

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Alle Elektronik GmbH

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Supply Digital

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Overview

Enhance your digital arithmetic circuits with the CD54HCT688F3A by Texas Instruments, known for its unparalleled quality and reliability. This ceramic, glass-sealed package offers a fast propagation delay of 42ns, making it ideal for a wide range of applications. With a nominal supply voltage of 5V and inverted output polarity, this product provides exceptional performance in military-grade environments. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides unmatched value to customers seeking top-of-the-line digital arithmetic solutions.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent protection for the circuitry inside, making the product durable and long-lasting.

Propagation Delay At Nominal Supply: 42 ns

The low propagation delay ensures fast and efficient operation of the circuit, making it suitable for applications that require quick calculations.

No. of Bits: 8

With 8 bits, this product offers sufficient precision for digital arithmetic operations, making it versatile for various mathematical computations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of electronic systems, simplifying integration.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it reliable for industrial applications.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Technical Specifications

Digital Arithmetic Circuits CD54HCT688F3A attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

HCT

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD54HCT688F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-265-2207, 5962012652207, 5962-01-235-6354, 5962012356354, 5962-01-340-0971, 5962013400971

NIIN

012652207, 012356354, 013400971

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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