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SN74AS632AFN

Texas Instruments

SN74AS632AFN by Texas Instruments

SN74AS632AFN by Texas Instruments is a 32-bit digital arithmetic circuit with 24ns propagation delay. Operating at 5V, it features 3-STATE output characteristics and supports a load capacitance of 50pF. Ideal for commercial applications requiring fast arithmetic processing in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,677 parts In-Stock

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7,677

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Digiode

USA . 1,474 parts In-Stock

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1,474

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Distributors (Availability)

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Andel Nordic

Denmark . 5,177 parts In-Stock

1+ parts

$2.789

100+ parts

-

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$2.677

10k+ parts

$2.677

5,177

$2.789

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$2.677

$2.677

Parana Technologies

USA . 569 parts In-Stock

1+ parts

$11.833

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-

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$12.234

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569

$11.833

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$12.234

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DigiPath Technology Company

USA . 2,258 parts In-Stock

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$13.030

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2,258

$13.030

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IDEA Electronic Components Group

UK . 2,330 parts In-Stock

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$13.296

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$12.631

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$11.966

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-

2,330

$13.296

$12.631

$11.966

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ChromeModa Solutions

Germany . 1,142 parts In-Stock

1+ parts

$13.296

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$10.903

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1,142

$13.296

$10.903

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One Stop Electronics

USA . 1,105 parts In-Stock

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$18.000

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1,105

$18.000

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AZTECH Wire

Italy . 330 parts In-Stock

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$19.599

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330

$19.599

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Corphita

USA . 4,094 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the top-quality SN74AS632AFN from Texas Instruments. With a reputation for excellence in the industry, Texas Instruments delivers superior performance and reliability in every product. Ideal for a wide range of applications, this 32-bit chip carrier offers customers unmatched value and benefits, including fast propagation delay, 3-state output characteristics, and a broad operating temperature range. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

No. of Bits: 32

High number of bits allows for more precise and accurate calculations.

Nominal Supply Voltage: 5V

Standard voltage supply makes it compatible with a wide range of systems.

Propagation Delay: 24 ns

Low propagation delay ensures fast processing speeds.

Output Characteristics: 3-STATE

3-STATE output allows for flexible control of output signals.

Technology: TTL

TTL technology provides high speed and reliability in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN74AS632AFN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

BUILT IN DIAGNOSTICS; BYTE CONTROL

Family:

AS

JESD-30 Code:

S-PQCC-J68

Length:

24.2316 mm

Load Capacitance (CL):

50 pF

No. of Bits:

32

No. of Functions:

1

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

330 mA

Propagation Delay (tpd):

24 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.2316 mm

Trade Compliance

SN74AS632AFN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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