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SN74AS1181FN

Texas Instruments

SN74AS1181FN by Texas Instruments

SN74AS1181FN by Texas Instruments is a 4-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 15ns. It is used in commercial applications, operates b/w 0-70°C, and has a max power supply current of 117mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,039 parts In-Stock

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7,039

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Digiode

USA . 1,850 parts In-Stock

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1,850

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Distributors (Availability)

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Andel Nordic

Denmark . 937 parts In-Stock

1+ parts

$3.149

100+ parts

-

1k+ parts

$3.023

10k+ parts

$3.023

937

$3.149

-

$3.023

$3.023

AZTECH Wire

Italy . 509 parts In-Stock

1+ parts

$10.540

100+ parts

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509

$10.540

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Parana Technologies

USA . 322 parts In-Stock

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$11.388

100+ parts

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$11.811

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322

$11.388

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$11.811

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ChromeModa Solutions

Germany . 3,104 parts In-Stock

1+ parts

$12.795

100+ parts

$10.492

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3,104

$12.795

$10.492

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$12.795

100+ parts

$12.155

1k+ parts

$11.516

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194

$12.795

$12.155

$11.516

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One Stop Electronics

USA . 513 parts In-Stock

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$60.000

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513

$60.000

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Corphita

USA . 2,043 parts In-Stock

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2,043

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DigiPath Technology Company

USA . 1,247 parts In-Stock

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$11.536

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1,247

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$11.536

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Overview

Upgrade your digital arithmetic circuits with the high-quality SN74AS1181FN by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers reliable products that meet the demands of various applications. This versatile 4-bit chip carrier offers a nominal supply voltage of 5V, low propagation delay, and a wide operating temperature range. Say goodbye to performance issues and hello to seamless operations with the SN74AS1181FN, providing exceptional value and benefits to customers looking for superior digital arithmetic solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving time and space.

No. of Bits: 4

Having 4 bits allows for more precise and complex calculations, making the product suitable for digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard electronic systems.

Propagation Delay (tpd): 15 ns

Low propagation delay of 15 ns ensures fast processing speed, ideal for time-sensitive applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance within standard operating temperature ranges, suitable for most commercial applications.

Technology: TTL

TTL technology offers low power consumption and high noise immunity, making the product efficient and reliable for digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN74AS1181FN attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

AS

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Power Supply Current (ICC):

117 mA

Propagation Delay (tpd):

15 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.5062 mm

Trade Compliance

SN74AS1181FN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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