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SN54HC881FK

Texas Instruments

SN54HC881FK by Texas Instruments

SN54HC881FK by Texas Instruments is a CMOS digital arithmetic circuit in a ceramic chip carrier package. With 28 terminals and operating temperatures ranging from -55°C to 125°C, it is ideal for military-grade applications requiring high reliability. This surface-mount square package offers quad terminal positioning with a 1.27mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,645 parts In-Stock

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3,645

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Digiode

USA . 63 parts In-Stock

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63

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Distributors (Availability)

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Andel Nordic

Denmark . 2,862 parts In-Stock

1+ parts

$5.037

100+ parts

-

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$4.835

10k+ parts

$4.835

2,862

$5.037

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$4.835

$4.835

AZTECH Wire

Italy . 615 parts In-Stock

1+ parts

$8.328

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615

$8.328

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Parana Technologies

USA . 1,518 parts In-Stock

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$10.592

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$11.091

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1,518

$10.592

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$11.091

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ChromeModa Solutions

Germany . 2,642 parts In-Stock

1+ parts

$11.901

100+ parts

$9.759

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2,642

$11.901

$9.759

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IDEA Electronic Components Group

UK . 1,466 parts In-Stock

1+ parts

$11.901

100+ parts

$11.306

1k+ parts

$10.711

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1,466

$11.901

$11.306

$10.711

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One Stop Electronics

USA . 1,153 parts In-Stock

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$46.000

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1,153

$46.000

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Corphita

USA . 1,536 parts In-Stock

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1,536

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DigiPath Technology Company

USA . 1,481 parts In-Stock

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$10.730

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1,481

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$10.730

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Overview

Unlock the full potential of your digital arithmetic circuits with the SN54HC881FK by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers reliability and performance in every product. Ideal for military-grade applications, this chip carrier package offers superior temperature tolerance and surface mount compatibility. Experience seamless integration and enhanced productivity with the innovative technology of the SN54HC881FK. Upgrade your circuit design today and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic provides excellent thermal conductivity and high resistance to temperature variations, making it suitable for military-grade applications that require reliable performance in extreme conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Package Shape: SQUARE

The square shape makes it easy to handle and mount on a circuit board, ensuring efficient use of space and a clean layout.

No. of Terminals: 28

With 28 terminals, this product offers flexibility in connecting to other components and peripherals, enabling complex digital arithmetic operations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides protection for the delicate CMOS technology inside while allowing for easy handling and installation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to function reliably in demanding environments without overheating or performance degradation.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can still operate effectively in cold conditions, maintaining its functionality in a wide range of environments.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection between the product and other components, reducing the risk of signal loss or interference.

Temperature Grade: MILITARY

Designed for military-grade applications, this product meets strict standards for reliability, durability, and performance in harsh environments.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high speed, and reliable digital logic operations, making it ideal for digital arithmetic circuits.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint failures, improving the product's overall reliability and longevity in operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting on circuit boards, enabling space-efficient designs and optimized performance in digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN54HC881FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N28

Logic IC Type:

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54HC881FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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