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CD74HC85PWE4

Texas Instruments

CD74HC85PWE4 by Texas Instruments

CD74HC85PWE4 by Texas Instruments is a 4-bit digital arithmetic circuit with 42ns propagation delay, suitable for military-grade applications. It operates at a supply voltage range of 2-6V, with a max power supply current of 0.08mA. The package style is small outline, thin profile, shrink pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,276 parts In-Stock

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Vyrian

USA . 2,312 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 291 parts In-Stock

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$9.988

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$9.988

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Parana Technologies

USA . 312 parts In-Stock

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$14.082

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$14.548

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312

$14.082

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$14.548

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DigiPath Technology Company

USA . 1,370 parts In-Stock

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$15.507

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$14.266

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$15.507

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ChromeModa Solutions

Germany . 959 parts In-Stock

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$15.823

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$12.975

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959

$15.823

$12.975

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IDEA Electronic Components Group

UK . 749 parts In-Stock

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$15.823

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$15.032

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$14.241

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749

$15.823

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$14.241

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One Stop Electronics

USA . 1,355 parts In-Stock

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$31.000

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Microchip USA

USA . 2,038 parts In-Stock

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Andel Nordic

Denmark . 565 parts In-Stock

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Corphita

USA . 281 parts In-Stock

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Native Components

USA . 100 parts In-Stock

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$3.424

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Northwest PG Solutions

USA . 81 parts In-Stock

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Overview

Looking for high-quality digital arithmetic circuits? Look no further than the Texas Instruments CD74HC85PWE4. With its fast propagation delay, low power consumption, and wide operating temperature range, this versatile component is perfect for a variety of applications. Whether you're designing consumer electronics or industrial equipment, this reliable product offers superior performance and reliability. Upgrade your designs with the Texas Instruments CD74HC85PWE4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the digital arithmetic circuit, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 42 ns

Low propagation delay enables fast processing of arithmetic operations, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V is within a common range, making integration with existing systems seamless.

No. of Bits: 4

The 4-bit design provides sufficient precision for arithmetic calculations while keeping the circuit simple and cost-effective.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this digital arithmetic circuit can withstand harsh environmental conditions and extended use.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this circuit energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits CD74HC85PWE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE, THREE POSSIBLE OUTPUTS ARE AB

Family:

HC/UH

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

42 ns

Propagation Delay (tpd):

295 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD74HC85PWE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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