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SN74ALS29806DW3

Texas Instruments

SN74ALS29806DW3 by Texas Instruments

SN74ALS29806DW3 by Texas Instruments is a TTL technology digital arithmetic circuit with 24 terminals in a small outline package. It operates b/w 0°C to 70°C, suitable for commercial applications. This surface-mount device features gull wing terminals and is commonly used in various electronic systems requiring arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,262 parts In-Stock

1+ parts

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3,262

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Digiode

USA . 1,339 parts In-Stock

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1,339

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 3,628 parts In-Stock

1+ parts

$7.056

100+ parts

-

1k+ parts

$6.774

10k+ parts

$6.774

3,628

$7.056

-

$6.774

$6.774

AZTECH Wire

Italy . 757 parts In-Stock

1+ parts

$11.407

100+ parts

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757

$11.407

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One Stop Electronics

USA . 711 parts In-Stock

1+ parts

$14.000

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-

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711

$14.000

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Parana Technologies

USA . 832 parts In-Stock

1+ parts

$26.612

100+ parts

-

1k+ parts

$27.175

10k+ parts

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832

$26.612

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$27.175

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DigiPath Technology Company

USA . 296 parts In-Stock

1+ parts

$29.303

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296

$29.303

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ChromeModa Solutions

Germany . 3,448 parts In-Stock

1+ parts

$29.901

100+ parts

$24.519

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3,448

$29.901

$24.519

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IDEA Electronic Components Group

UK . 1,892 parts In-Stock

1+ parts

$29.901

100+ parts

$28.406

1k+ parts

$26.911

10k+ parts

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1,892

$29.901

$28.406

$26.911

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Corphita

USA . 3,337 parts In-Stock

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3,337

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Overview

Experience the superior quality and reliability of Texas Instruments with the SN74ALS29806DW3 digital arithmetic circuit. This versatile component is perfect for a wide range of applications, offering high performance and precision in a compact package. With Texas Instruments' reputation for excellence, you can trust that this product will deliver exceptional value and benefits to your projects.Upgrade your designs with the SN74ALS29806DW3 and see the difference TI technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal circuitry of the product, ensuring long-term functionality.

Surface Mount: YES

Surface mount technology allows for efficient assembly and compact design, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape makes the product easy to handle and integrate into existing circuit layouts.

No. of Terminals: 24

Having 24 terminals allows for a wide range of input and output connections, offering versatility in application.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability in various environmental conditions, making it suitable for industrial use.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality in colder environments, enhancing the product's versatility.

Technology: TTL

The TTL technology offers fast switching speeds and reliable performance, making it suitable for high-speed digital arithmetic operations.

Technical Specifications

Digital Arithmetic Circuits SN74ALS29806DW3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS29806DW3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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