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SN54AS282FK

Texas Instruments

SN54AS282FK by Texas Instruments

SN54AS282FK by Texas Instruments is a 4-bit digital arithmetic circuit with TTL technology. It operates b/w -55 to 125 °C and has a supply voltage range of 4.5V to 5.5V, making it suitable for military-grade applications requiring high reliability and precision calculations in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,586 parts In-Stock

1+ parts

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3,586

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Digiode

USA . 258 parts In-Stock

1+ parts

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258

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 745 parts In-Stock

1+ parts

$3.012

100+ parts

-

1k+ parts

$2.892

10k+ parts

$2.892

745

$3.012

-

$2.892

$2.892

AZTECH Wire

Italy . 270 parts In-Stock

1+ parts

$18.720

100+ parts

-

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270

$18.720

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Parana Technologies

USA . 817 parts In-Stock

1+ parts

$29.690

100+ parts

$2,757.121

1k+ parts

$26.721

10k+ parts

-

817

$29.690

$2,757.121

$26.721

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DigiPath Technology Company

USA . 967 parts In-Stock

1+ parts

$32.692

100+ parts

-

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967

$32.692

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$33.359

100+ parts

$31.691

1k+ parts

$30.023

10k+ parts

-

1,541

$33.359

$31.691

$30.023

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ChromeModa Solutions

Germany . 143 parts In-Stock

1+ parts

$33.359

100+ parts

$27.354

1k+ parts

-

10k+ parts

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143

$33.359

$27.354

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One Stop Electronics

USA . 1,080 parts In-Stock

1+ parts

$46.000

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1,080

$46.000

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Corphita

USA . 3,451 parts In-Stock

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3,451

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Overview

Elevate your digital arithmetic circuits with the SN54AS282FK by Texas Instruments. This high-quality chip carrier boasts a ceramic, metal-sealed cofired package body material and military-grade temperature grade, ensuring durability and reliability in any application. With a nominal supply voltage of 5V and 4 bits, this versatile component is perfect for a wide range of electronics projects. Trust Texas Instruments for top-notch technology that delivers exceptional performance every time. Experience the value and benefits of the SN54AS282FK today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for harsh environments.

No. of Bits: 4

Offers sufficient precision for various digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with many systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial applications.

Technology: TTL

Utilizes TTL technology known for its high-speed operation and compatibility.

Technical Specifications

Digital Arithmetic Circuits SN54AS282FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD; WITH ACTIVE HIGH OR LOW SELECTABLE CARRY INPUTS

Family:

AS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SN54AS282FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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