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SN74LS83AJP4

Texas Instruments

SN74LS83AJP4 by Texas Instruments

SN74LS83AJP4 by Texas Instruments is a TTL digital arithmetic circuit with 16 terminals, operating at 5V. It has a rectangular ceramic package style and can function in temperatures ranging from 0 to 70°C. This component is commonly used in commercial applications requiring precise arithmetic calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,600

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-

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Digiode

USA . 4,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$8.848

100+ parts

-

1k+ parts

-

10k+ parts

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246

$8.848

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-

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One Stop Electronics

USA . 1,621 parts In-Stock

1+ parts

$12.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,621

$12.000

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Parana Technologies

USA . 302 parts In-Stock

1+ parts

$16.069

100+ parts

$1,492.246

1k+ parts

$14.462

10k+ parts

-

302

$16.069

$1,492.246

$14.462

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DigiPath Technology Company

USA . 2,323 parts In-Stock

1+ parts

$17.694

100+ parts

-

1k+ parts

-

10k+ parts

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2,323

$17.694

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ChromeModa Solutions

Germany . 2,973 parts In-Stock

1+ parts

$18.055

100+ parts

$14.805

1k+ parts

-

10k+ parts

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2,973

$18.055

$14.805

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IDEA Electronic Components Group

UK . 1,139 parts In-Stock

1+ parts

$18.055

100+ parts

$17.152

1k+ parts

$16.250

10k+ parts

-

1,139

$18.055

$17.152

$16.250

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Andel Nordic

Denmark . 4,333 parts In-Stock

1+ parts

$76.111

100+ parts

-

1k+ parts

$73.067

10k+ parts

$73.067

4,333

$76.111

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$73.067

$73.067

Corphita

USA . 4,875 parts In-Stock

1+ parts

-

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4,875

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Overview

Enhance your digital arithmetic circuits with the SN74LS83AJP4 by Texas Instruments. Known for their top-notch quality, Texas Instruments delivers unmatched reliability and performance in all their products. This versatile component is perfect for a wide range of applications, offering seamless integration and exceptional value. Upgrade your electronic projects today with the SN74LS83AJP4 and experience the benefits of precision engineering and cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, making the product sturdy and resistant to damage from external factors.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is commonly used in electronic devices, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can operate efficiently even in high-temperature environments.

Technology: TTL

TTL technology offers high speed and efficiency in digital circuits, making this product suitable for fast processing requirements.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection, ensuring stable performance of the product over time.

Technical Specifications

Digital Arithmetic Circuits SN74LS83AJP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS83AJP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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