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SN74LS348N3

Texas Instruments

SN74LS348N3 by Texas Instruments

SN74LS348N3 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 21ns. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. This TTL technology component is commonly used in applications requiring fast data processing and control signal management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,068 parts In-Stock

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Digiode

USA . 4,255 parts In-Stock

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4,255

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Distributors (Availability)

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One Stop Electronics

USA . 1,495 parts In-Stock

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$13.000

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1,495

$13.000

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AZTECH Wire

Italy . 559 parts In-Stock

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$18.773

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559

$18.773

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Parana Technologies

USA . 1,208 parts In-Stock

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$21.391

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$21.734

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$21.391

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$21.734

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DigiPath Technology Company

USA . 680 parts In-Stock

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$23.554

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$21.670

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680

$23.554

$21.670

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ChromeModa Solutions

Germany . 5,863 parts In-Stock

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$24.035

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$19.709

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$24.035

$19.709

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IDEA Electronic Components Group

UK . 2,098 parts In-Stock

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$24.035

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$22.833

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$21.632

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2,098

$24.035

$22.833

$21.632

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Corphita

USA . 4,276 parts In-Stock

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Andel Nordic

Denmark . 997 parts In-Stock

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Overview

Unlock the possibilities of digital arithmetic circuits with the SN74LS348N3 by Texas Instruments. Known for their high-quality components, Texas Instruments delivers reliable performance in every product they create. Ideal for a wide range of applications, this 8-bit arithmetic circuit offers fast propagation delay and low power consumption, making it a valuable asset for any project. Trust in Texas Instruments to provide the tools you need to bring your designs to life with precision and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good protection against external factors and ensures durability of the circuit.

No. of Bits: 8

8 bits provide sufficient precision for arithmetic operations in digital circuits.

Nominal Supply Voltage / Vsup (V): 5

Operating at 5V ensures compatibility with common digital systems and power sources.

Propagation Delay (tpd): 21 ns

Low propagation delay helps in faster computation and response times in digital circuits.

Technology: TTL

TTL technology offers high speed and efficient operation in digital circuits.

Technical Specifications

Digital Arithmetic Circuits SN74LS348N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

8 TO 3 LINE PRIORITY ENCODER

Family:

LS

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

SN74LS348N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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