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SNJ54LS181FK

Texas Instruments

SNJ54LS181FK by Texas Instruments

SNJ54LS181FK by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 62ns. Operating at a supply voltage of 5V, it is ideal for military-grade applications due to its MIL-PRF-38535 screening level. This chip carrier package has 28 terminals and operates within a temperature range of -55°C to 125°C.

Median Price

$22.897

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$22.897

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500

$22.897

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Vyrian

USA . 4,460 parts In-Stock

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4,460

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Digiode

USA . 2,105 parts In-Stock

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2,105

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Resion

USA . 124 parts In-Stock

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124

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One Stop Electronics

USA . 150 parts In-Stock

1+ parts

$5.000

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$5.000

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Andel Nordic

Denmark . 2,331 parts In-Stock

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$9.700

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$9.312

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$9.312

2,331

$9.700

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$9.312

$9.312

AZTECH Wire

Italy . 869 parts In-Stock

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$13.115

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869

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Parana Technologies

USA . 1,538 parts In-Stock

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$26.529

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$27.105

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1,538

$26.529

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ChromeModa Solutions

Germany . 6,028 parts In-Stock

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$29.808

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$24.443

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$29.808

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IDEA Electronic Components Group

UK . 180 parts In-Stock

1+ parts

$29.808

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$28.318

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$26.827

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180

$29.808

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$26.827

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Corphita

USA . 1,376 parts In-Stock

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DigiPath Technology Company

USA . 763 parts In-Stock

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$26.875

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$26.875

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Overview

Upgrade your digital arithmetic circuits with the SNJ54LS181FK by Texas Instruments, a high-quality chip carrier package that offers unmatched performance and reliability. Designed for military-grade applications, this square-shaped component is built to withstand extreme temperatures and rigorous environments. With a true output polarity and fast propagation delay, this versatile device provides precise calculations with minimal power consumption. Trust Texas Instruments for cutting-edge technology and superior engineering in every product they deliver. Experience the value and benefits of the SNJ54LS181FK for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, ideal for military applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

No. of Bits: 4

Offers sufficient bit resolution for digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, compatible with most systems.

Package Style (Meter): CHIP CARRIER

Compact size and efficient heat dissipation for high reliability.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environments.

Technology: TTL

Uses transistor-transistor logic for fast and efficient operation.

Technical Specifications

Digital Arithmetic Circuits SNJ54LS181FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS; INTERNAL CARRY AND HIGHER ORDER LOOKAHEAD

Family:

LS

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

35 mA

Propagation Delay (tpd):

62 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

SNJ54LS181FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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