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SN74AS881NTP3

Texas Instruments

SN74AS881NTP3 by Texas Instruments

SN74AS881NTP3 by Texas Instruments is a 24-terminal TTL digital arithmetic circuit with temp range of 0-70°C. Its package is rectangular, made of plastic/epoxy, and has an in-line style. Ideal for commercial applications requiring dual terminal position and 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,364 parts In-Stock

1+ parts

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2,364

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Digiode

USA . 1,041 parts In-Stock

1+ parts

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 971 parts In-Stock

1+ parts

$3.089

100+ parts

-

1k+ parts

$2.966

10k+ parts

$2.966

971

$3.089

-

$2.966

$2.966

Parana Technologies

USA . 161 parts In-Stock

1+ parts

$10.356

100+ parts

-

1k+ parts

$10.872

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161

$10.356

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$10.872

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AZTECH Wire

Italy . 325 parts In-Stock

1+ parts

$10.723

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325

$10.723

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DigiPath Technology Company

USA . 870 parts In-Stock

1+ parts

$11.403

100+ parts

$10.491

1k+ parts

-

10k+ parts

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870

$11.403

$10.491

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ChromeModa Solutions

Germany . 2,116 parts In-Stock

1+ parts

$11.636

100+ parts

$9.542

1k+ parts

-

10k+ parts

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2,116

$11.636

$9.542

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IDEA Electronic Components Group

UK . 1,173 parts In-Stock

1+ parts

$11.636

100+ parts

$11.054

1k+ parts

$10.472

10k+ parts

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1,173

$11.636

$11.054

$10.472

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One Stop Electronics

USA . 769 parts In-Stock

1+ parts

$59.000

100+ parts

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769

$59.000

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Corphita

USA . 797 parts In-Stock

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797

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Overview

Elevate your digital arithmetic circuits with the SN74AS881NTP3 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile component is perfect for a wide range of applications, offering unparalleled performance and precision. Upgrade your electronic projects with the SN74AS881NTP3 and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external impacts, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient and compact integration of the circuit into various electronic devices.

No. of Terminals: 24

Having 24 terminals provides enough connectivity options for complex arithmetic calculations, making the product versatile and capable of handling various tasks.

Package Style (Meter): IN-LINE

The in-line package style makes it easier to install and connect the circuit in a linear layout, saving space and simplifying the overall design process.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperature environments without compromising performance, ensuring reliability in different conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for use in a wide range of environments, including colder climates or refrigerated areas.

Terminal Position: DUAL

Having dual terminal positions allows for easy and secure connections, enhancing the overall stability and reliability of the circuit.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets industry standards for temperature range, making it suitable for commercial applications.

Technology: TTL

The use of TTL technology provides fast and precise arithmetic operations, making the product ideal for digital calculation tasks that require speed and accuracy.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the installation process and provides secure connections, reducing the risk of connectivity issues or signal interference.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the product offers efficient spacing for easy connections and compatibility with standard electronic components, ensuring smooth integration into various circuits.

Technical Specifications

Digital Arithmetic Circuits SN74AS881NTP3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74AS881NTP3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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