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SN54ALS519FH

Texas Instruments

SN54ALS519FH by Texas Instruments

SN54ALS519FH by Texas Instruments is a TTL digital arithmetic circuit in a ceramic chip carrier package. Operating at temperatures from -55°C to 125°C, it has 20 terminals with a terminal pitch of 1.27mm and requires a nominal voltage of 5V. Ideal for military-grade applications requiring high-performance arithmetic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,691 parts In-Stock

1+ parts

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7,691

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Digiode

USA . 3,459 parts In-Stock

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3,459

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Distributors (Availability)

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Andel Nordic

Denmark . 5,045 parts In-Stock

1+ parts

$2.750

100+ parts

-

1k+ parts

$2.640

10k+ parts

$2.640

5,045

$2.750

-

$2.640

$2.640

One Stop Electronics

USA . 1,300 parts In-Stock

1+ parts

$3.000

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1,300

$3.000

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AZTECH Wire

Italy . 796 parts In-Stock

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$16.136

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796

$16.136

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Parana Technologies

USA . 130 parts In-Stock

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$21.532

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$21.919

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130

$21.532

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$21.919

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DigiPath Technology Company

USA . 967 parts In-Stock

1+ parts

$23.709

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967

$23.709

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ChromeModa Solutions

Germany . 4,529 parts In-Stock

1+ parts

$24.193

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$19.838

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4,529

$24.193

$19.838

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IDEA Electronic Components Group

UK . 1,919 parts In-Stock

1+ parts

$24.193

100+ parts

$22.983

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$21.774

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1,919

$24.193

$22.983

$21.774

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Corphita

USA . 2,679 parts In-Stock

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2,679

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Overview

Enhance your digital arithmetic circuits with the SN54ALS519FH by Texas Instruments. Known for their superior quality and cutting-edge technology, Texas Instruments offers a reliable solution for your circuit needs. Ideal for military-grade applications, this chip carrier package is designed for durability and precision. With a nominal supply voltage of 5V, this component provides optimal performance in a range of temperatures. Elevate your designs with the SN54ALS519FH and experience the value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity and heat dissipation, making them ideal for high-performance applications that require reliable operation under harsh conditions.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, enabling space-saving integration of the digital arithmetic circuit into electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard nominal supply voltage of 5V ensures compatibility with commonly used power sources and simplifies integration into existing circuits.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the digital arithmetic circuit can reliably function in demanding environments without the risk of overheating.

Technology: TTL

Utilizing Transistor-Transistor Logic technology ensures high-speed operation and low power consumption, making the digital arithmetic circuit suitable for efficient computation tasks.

Technical Specifications

Digital Arithmetic Circuits SN54ALS519FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54ALS519FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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