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SN54AS181AJ

Texas Instruments

SN54AS181AJ by Texas Instruments

SN54AS181AJ by Texas Instruments is a 24-terminal digital arithmetic circuit in ceramic package. Operates b/w -55°C to 125°C, MILITARY grade TTL technology with RECTANGULAR shape. Ideal for military applications requiring high temperature resistance and reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,384 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,384

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Digiode

USA . 1,076 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,076

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,815 parts In-Stock

1+ parts

$7.599

100+ parts

-

1k+ parts

$8.110

10k+ parts

-

1,815

$7.599

-

$8.110

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ChromeModa Solutions

Germany . 3,790 parts In-Stock

1+ parts

$8.538

100+ parts

$7.001

1k+ parts

-

10k+ parts

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3,790

$8.538

$7.001

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IDEA Electronic Components Group

UK . 274 parts In-Stock

1+ parts

$8.538

100+ parts

$8.111

1k+ parts

$7.684

10k+ parts

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274

$8.538

$8.111

$7.684

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$8.993

100+ parts

-

1k+ parts

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765

$8.993

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One Stop Electronics

USA . 672 parts In-Stock

1+ parts

$45.000

100+ parts

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672

$45.000

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Corphita

USA . 376 parts In-Stock

1+ parts

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376

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DigiPath Technology Company

USA . 323 parts In-Stock

1+ parts

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100+ parts

$7.698

1k+ parts

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323

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$7.698

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Overview

Unleash the power of cutting-edge technology with the SN54AS181AJ by Texas Instruments. Crafted with precision and innovation, this digital arithmetic circuit offers unparalleled performance and reliability. With a military-grade temperature range and advanced TTL technology, this product is ideal for a wide range of applications. Whether you're designing complex computing systems or enhancing your electronic projects, the SN54AS181AJ delivers unmatched value, efficiency, and quality. Elevate your work to new heights with this top-of-the-line component from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent heat dissipation, making this product suitable for high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to place and mount the circuit in various devices, reducing design complexities.

No. of Terminals: 24

Having more terminals allows for more connectivity options, making the product versatile for different applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the product can also function in cold environments without any issues.

Temperature Grade: MILITARY

Military-grade temperature grade ensures high reliability and durability, making this product suitable for critical applications.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making this product efficient and reliable for arithmetic operations.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration into existing circuit boards and systems.

Technical Specifications

Digital Arithmetic Circuits SN54AS181AJ attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T24

Logic IC Type:

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN54AS181AJ Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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