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SNJ54182W-00

Texas Instruments

SNJ54182W-00 by Texas Instruments

SNJ54182W-00 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 22ns. It operates in a temperature range from -55 to 125°C and has a supply voltage of 4.5-5.5V, making it ideal for military-grade applications requiring fast calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,265 parts In-Stock

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8,265

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Digiode

USA . 1,311 parts In-Stock

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1,311

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 225 parts In-Stock

1+ parts

$9.427

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225

$9.427

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Parana Technologies

USA . 2,209 parts In-Stock

1+ parts

$26.987

100+ parts

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$30.886

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2,209

$26.987

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$30.886

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ChromeModa Solutions

Germany . 5,732 parts In-Stock

1+ parts

$30.322

100+ parts

$24.864

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5,732

$30.322

$24.864

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IDEA Electronic Components Group

UK . 66 parts In-Stock

1+ parts

$30.322

100+ parts

$28.806

1k+ parts

$27.290

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66

$30.322

$28.806

$27.290

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One Stop Electronics

USA . 886 parts In-Stock

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$45.000

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886

$45.000

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Corphita

USA . 2,300 parts In-Stock

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2,300

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$27.338

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$27.338

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Overview

Elevate your projects with the SNJ54182W-00 from Texas Instruments, a leading manufacturer known for top-quality digital arithmetic circuits. Designed for precision and reliability, this versatile component offers a wide range of applications in various industries. With a focus on providing value to customers, this product stands out for its exceptional performance, efficiency, and durability. Trust Texas Instruments to deliver the innovation you need for your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and excellent protection for the internal components of the circuit, ensuring long-term reliability.

No. of Bits: 4

Provides sufficient computation capability for basic arithmetic operations, suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level commonly used in digital circuits, ensuring compatibility with existing systems.

Propagation Delay (tpd): 22 ns

Delivers quick response times for arithmetic calculations, contributing to the overall efficiency of the circuit.

Temperature Grade: MILITARY

Designed to withstand a wide range of temperature conditions, making it suitable for use in demanding environments.

Technical Specifications

Digital Arithmetic Circuits SNJ54182W-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH HIGHER ORDER LOOKAHEAD

Family:

TTL/H/L

JESD-30 Code:

R-GDFP-F16

Length:

10.2 mm

Load Capacitance (CL):

15 pF

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.73 mm

Trade Compliance

SNJ54182W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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