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MC14585BCPG

Onsemi

MC14585BCPG by Onsemi

MC14585BCPG by Onsemi is a 4-bit digital arithmetic circuit with 16 terminals. It operates at a supply voltage of 5V and has a propagation delay of 860ns. Widely used in military applications due to its CMOS technology and inverted output polarity.

Median Price

$0.495

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$0.220

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88

$0.220

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Component Electronics Inc.

Canada . 100 parts In-Stock

1+ parts

$0.770

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$0.580

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$0.500

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100

$0.770

$0.580

$0.500

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Vyrian

USA . 2,318 parts In-Stock

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2,318

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Digiode

USA . 1,962 parts In-Stock

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Euro-Tech

UK . 450 parts In-Stock

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,801 parts In-Stock

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$0.220

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$0.216

4,801

$0.220

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$0.216

Argo Parts USA

USA . 3,529 parts In-Stock

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$0.220

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$0.213

3,529

$0.220

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$0.213

Netroflash

USA . 500 parts In-Stock

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$0.220

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500

$0.220

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Corohmni

South Africa . 212 parts In-Stock

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$0.770

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212

$0.770

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AZTECH Wire

Italy . 445 parts In-Stock

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$14.727

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445

$14.727

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Ampacity Inc.

Singapore . 891 parts In-Stock

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$26.000

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891

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Kulean Microsystems

USA . 8,201 parts In-Stock

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8,201

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TANS Electronics

Latvia . 7,656 parts In-Stock

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Microchip USA

USA . 5,359 parts In-Stock

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SupplyDigital Components

Austria . 3,969 parts In-Stock

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3,969

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Problanco Electronics

Mexico . 3,687 parts In-Stock

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Corphita

USA . 1,103 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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Kepictronics

USA . 57 parts In-Stock

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Overview

Unlock the power of digital arithmetic circuits with the MC14585BCPG by Onsemi. This high-quality product offers customers a reliable and efficient solution for their arithmetic needs. With a focus on innovation and excellence, Onsemi delivers top-notch performance and durability in every component they manufacture. Ideal for a wide range of applications, this product provides added value and benefits to customers looking for precision and accuracy in their digital circuitry. Upgrade your projects today with the MC14585BCPG and experience the advantages of working with a trusted leader in the industry.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making it a reliable choice for long-term use.

Package Shape:

RECTANGULAR - The compact shape allows for easy integration into various electronic systems, making it versatile for different applications.

No. of Bits:

4 - With a high number of bits, this product can perform complex arithmetic calculations accurately and efficiently.

Nominal Supply Voltage / Vsup (V):

5 - The stable supply voltage ensures consistent performance and reliable operation in different environments.

Power Supplies (V):

5/15 - The multiple power supply options allow for flexibility in powering the circuit, accommodating different system requirements.

No. of Terminals:

16 - The ample number of terminals enables easy connectivity with other components, enhancing the usability of the product.

Package Style (Meter):

IN-LINE - The in-line package style offers a streamlined design that saves space and simplifies installation in tight spaces.

Propagation Delay (tpd):

860 ns - The fast propagation delay time ensures quick response and high-speed operation for time-critical applications.

Maximum Operating Temperature:

125 °C - With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature allows for reliable operation even in extreme cold environments.

Terminal Finish:

Tin (Sn) - The tin terminal finish provides good conductivity and corrosion resistance, ensuring stable connections for optimal performance.

Terminal Position:

DUAL - The dual terminal position offers flexibility in component orientation, making it easier to integrate into various circuit layouts.

Maximum Seated Height:

4.44 mm - The compact seated height allows for efficient use of space and easy integration into slim electronic devices.

Width:

7.62 mm - The moderate width makes this product suitable for applications with limited space while maintaining ease of installation and connection.

Output Polarity:

INVERTED - The inverted output polarity offers versatility in signal processing and compatibility with different circuit configurations.

Minimum Supply Voltage (Vsup):

3 V - The low minimum supply voltage allows for operation in low-power settings, making it energy-efficient and cost-effective.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures robust solder connections during assembly, enhancing the product's reliability.

Length:

19.175 mm - The moderate length provides a balance between compactness and accessibility for easy integration into electronic systems.

Temperature Grade:

MILITARY - The military-grade temperature rating ensures reliability and performance under harsh conditions, making it suitable for demanding applications.

Technology:

CMOS - The CMOS technology offers low power consumption and high noise immunity, making this product efficient and reliable for various applications.

Terminal Form:

THROUGH-HOLE - The through-hole terminal form provides secure connections and ease of soldering, ensuring reliable performance in different environments.

Terminal Pitch:

2.54 mm - The standard terminal pitch allows for easy compatibility with other components and facilitates efficient circuit design and assembly.

Maximum Supply Voltage (Vsup):

18 V - The high maximum supply voltage accommodates a wide range of power requirements, making this product versatile for different applications.

Technical Specifications

Digital Arithmetic Circuits MC14585BCPG attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

860 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14585BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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