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MC14008BDR2

Onsemi

MC14008BDR2 by Onsemi

MC14008BDR2 by Onsemi is a 4-bit digital arithmetic circuit with 800 ns propagation delay. Operating at temperatures from -55 to 125 °C, it has a supply voltage range of 3-18 V. Ideal for military applications, this CMOS technology chip comes in a small outline package with dual terminals.

Median Price

$0.185

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,406 parts In-Stock

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-

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$0.185

1k+ parts

$0.153

10k+ parts

$0.137

1,406

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$0.185

$0.153

$0.137

Distributors (In-Stock)

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Vyrian

USA . 1,578 parts In-Stock

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$0.130

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Digiode

USA . 2,493 parts In-Stock

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$0.144

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Tectiva GmbH

Germany . 2,400 parts In-Stock

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2,400

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LIBRA Elektronik GmbH

Germany . 1,866 parts In-Stock

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Semi Source

USA . 1,200 parts In-Stock

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Technoshack Inc.

Canada . 180 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 439 parts In-Stock

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439

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Corphita

USA . 1,722 parts In-Stock

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$0.137

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Component Stockers USA

USA . 2,054 parts In-Stock

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$0.160

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$0.150

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$0.130

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2,054

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Andel Nordic

Denmark . 1,892 parts In-Stock

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$2.292

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$2.200

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1,892

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$2.200

QUARKTWIN TECHNOLOGY LTD

USA . 19,953 parts In-Stock

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TANS Electronics

Latvia . 7,192 parts In-Stock

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Problanco Electronics

Mexico . 6,471 parts In-Stock

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Microchip USA

USA . 5,463 parts In-Stock

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SupplyDigital Components

Austria . 2,972 parts In-Stock

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Continental Prestige Electronics

USA . 1,406 parts In-Stock

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UHIMA Technologies

Türkiye . 653 parts In-Stock

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Perfect Parts

USA . 224 parts In-Stock

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Kulean Microsystems

USA . 88 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of the MC14008BDR2 by Onsemi, a leading manufacturer of innovative digital arithmetic circuits. This high-performance product offers customers a versatile solution for various applications in the digital realm. With its advanced technology and superior design, this product ensures optimal performance and efficiency, making it a valuable asset for any project. Trust Onsemi to deliver exceptional products that exceed expectations and empower your designs to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the circuit, making it suitable for various operating environments.

Surface Mount: YES

Being surface mountable, this circuit can be easily integrated into PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this circuit is compatible with standard power sources, making it easy to integrate into existing systems.

No. of Bits: 4

The 4-bit design allows for basic arithmetic calculations, suitable for simple digital processing tasks.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the circuit.

Technical Specifications

Digital Arithmetic Circuits MC14008BDR2 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

800 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC14008BDR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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