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MC14532BCP

Onsemi

MC14532BCP by Onsemi

MC14532BCP by Onsemi is an 8-bit digital arithmetic circuit with a supply voltage of 5V. It has a propagation delay of 600ns and operates in temperatures ranging from -55 to 125 °C. This CMOS technology device is commonly used in military-grade applications requiring precise arithmetic calculations.

Median Price

$1.540

Lifecycle Status

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Metaverse IC Inc.

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Overview

Enhance your digital arithmetic circuits with the MC14532BCP by Onsemi, a top-quality product renowned for its reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled value with its innovative design and versatile applications. Ideal for a wide range of digital arithmetic tasks, this product delivers exceptional benefits to customers by providing fast and accurate results, making it an essential component for any electronics project. Upgrade your circuits today with the MC14532BCP and experience the difference in quality and efficiency that Onsemi products provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and resistant to damage during handling and assembly.

No. of Bits: 8

Having 8 bits allows for a wide range of values to be processed, making the product suitable for various arithmetic operations and calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides a standard power source for the circuit, ensuring compatibility with common power sources.

Propagation Delay (tpd): 600 ns

With a low propagation delay of 600 ns, the circuit can quickly process input signals and provide output results efficiently.

Maximum Operating Temperature: 125 °C

The product can operate in high-temperature environments up to 125 °C, making it suitable for a wide range of industrial applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits MC14532BCP attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC14532BCP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-376-4328, 5962013764328

NIIN

013764328

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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