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MC14532BDR2

Onsemi

MC14532BDR2 by Onsemi

MC14532BDR2 by Onsemi is an 8-bit digital arithmetic circuit with a supply voltage of 5V and power supplies of 5/15V. It has a propagation delay of 600ns, operates in temperatures ranging from -55 to 125 °C, and is ideal for military-grade applications requiring CMOS technology.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,000 parts In-Stock

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-

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$0.225

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$0.186

10k+ parts

$0.166

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-

$0.225

$0.186

$0.166

DigiKey

USA . 10,000 parts In-Stock

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$0.280

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$0.280

Verical

USA . 10,000 parts In-Stock

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$0.208

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$0.208

Distributors (In-Stock)

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Digiode

USA . 879 parts In-Stock

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$0.175

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$0.175

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Vyrian

USA . 309 parts In-Stock

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$0.184

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DigiKey Marketplace

USA . 10,000 parts In-Stock

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Bristol Electronics

USA . 1,181 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 312 parts In-Stock

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$0.166

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312

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Corohmni

South Africa . 106 parts In-Stock

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$0.184

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106

$0.184

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Andel Nordic

Denmark . 3,337 parts In-Stock

1+ parts

$4.705

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$4.517

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$4.517

3,337

$4.705

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$4.517

$4.517

QUARKTWIN TECHNOLOGY LTD

USA . 26,443 parts In-Stock

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Continental Prestige Electronics

USA . 10,000 parts In-Stock

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$0.159

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SupplyDigital Components

Austria . 6,497 parts In-Stock

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Kulean Microsystems

USA . 4,850 parts In-Stock

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Microchip USA

USA . 4,000 parts In-Stock

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Problanco Electronics

Mexico . 3,543 parts In-Stock

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TANS Electronics

Latvia . 616 parts In-Stock

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UHIMA Technologies

Türkiye . 249 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the MC14532BDR2 by Onsemi, a top-quality product from a trusted manufacturer. This versatile component offers a wide range of applications, providing customers with reliable performance and efficient functionality. With its compact design, high-grade materials, and advanced technology, this product guarantees optimal results for your projects. Upgrade your digital circuits today and experience the superior value and benefits that the MC14532BDR2 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the digital arithmetic circuit, making it suitable for various operating environments.

No. of Bits: 8

Having 8 bits allows for a wide range of mathematical calculations and operations, providing flexibility and precision in digital arithmetic tasks.

Propagation Delay (tpd): 600 ns

The low propagation delay of 600 ns ensures fast and efficient processing of arithmetic operations, making the circuit suitable for time-sensitive applications.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the digital arithmetic circuit can operate reliably in extreme temperature conditions, making it suitable for rugged environments.

Technology: CMOS

The CMOS technology used in the circuit offers low power consumption and high noise immunity, making it energy-efficient and reliable for digital arithmetic tasks.

Technical Specifications

Digital Arithmetic Circuits MC14532BDR2 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

600 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC14532BDR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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