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MC14008BCP

Onsemi

MC14008BCP by Onsemi

MC14008BCP by Onsemi is a 4-bit digital arithmetic circuit with 16 terminals. It operates at a supply voltage range of 3-18V and has a propagation delay of 800ns. Ideal for military applications due to its CMOS technology and wide temperature range (-55 to 125 °C).

Median Price

$1.600

Lifecycle Status

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35

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1k+

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Fibra_Brandt Electronic GMBH

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LIBRA Elektronik GmbH

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Goldney Electronics S.L.

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Corohmni

South Africa . 143 parts In-Stock

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Andel Nordic

Denmark . 3,775 parts In-Stock

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Component Stockers USA

USA . 275 parts In-Stock

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Problanco Electronics

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Overview

Enhance your digital arithmetic circuits with the MC14008BCP by Onsemi, a high-quality product that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is designed for a wide range of applications, providing customers with value and versatility. With a nominal supply voltage of 5V and a maximum operating temperature of 125 °C, this product delivers superior functionality while maintaining efficiency. Upgrade your circuits today with the MC14008BCP and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the circuit, making it suitable for various applications and environments.

No. of Bits: 4

Having 4 bits allows for a reasonable range of values to be processed, making the circuit versatile for different arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with most electronic systems and components.

Propagation Delay (tpd): 800 ns

With a relatively low propagation delay, this circuit can provide quick results for arithmetic calculations, enhancing overall performance.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this circuit ensures reliability and stability even in harsh environmental conditions.

Technology: CMOS

Using CMOS technology results in low power consumption, high noise immunity, and compatibility with a wide range of devices and systems.

Technical Specifications

Digital Arithmetic Circuits MC14008BCP attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Propagation Delay (tpd):

800 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn80Pb20)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.62 mm

Trade Compliance

MC14008BCP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-116-5772, 5962011165772

NIIN

011165772

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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