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SN74S381N1

Texas Instruments

SN74S381N1 by Texas Instruments

SN74S381N1 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise calculations in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,415

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-

-

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Digiode

USA . 3,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

3,249

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,530 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,530

$4.000

-

-

-

Andel Nordic

Denmark . 507 parts In-Stock

1+ parts

$9.151

100+ parts

-

1k+ parts

$8.785

10k+ parts

$8.785

507

$9.151

-

$8.785

$8.785

Parana Technologies

USA . 1,995 parts In-Stock

1+ parts

$14.092

100+ parts

$1,308.680

1k+ parts

$12.683

10k+ parts

-

1,995

$14.092

$1,308.680

$12.683

-

DigiPath Technology Company

USA . 883 parts In-Stock

1+ parts

$15.517

100+ parts

$14.276

1k+ parts

-

10k+ parts

-

883

$15.517

$14.276

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-

ChromeModa Solutions

Germany . 3,202 parts In-Stock

1+ parts

$15.834

100+ parts

$12.984

1k+ parts

-

10k+ parts

-

3,202

$15.834

$12.984

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-

IDEA Electronic Components Group

UK . 20 parts In-Stock

1+ parts

$15.834

100+ parts

$15.042

1k+ parts

$14.251

10k+ parts

-

20

$15.834

$15.042

$14.251

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$16.748

100+ parts

-

1k+ parts

-

10k+ parts

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817

$16.748

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Corphita

USA . 3,528 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,528

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the SN74S381N1 digital arithmetic circuit. This versatile component offers seamless integration into a wide range of applications, providing customers with efficient and accurate performance. With a focus on value and benefits, this product ensures that your projects run smoothly and effectively. Trust in Texas Instruments to deliver excellence in every aspect of your electronic designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the digital arithmetic circuit, making it a reliable choice for long-term use.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with a wide range of systems and devices, making it versatile for various applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this digital arithmetic circuit can withstand high temperature environments without compromising performance.

Technology: TTL

The TTL technology used in this circuit provides fast switching speeds and high noise immunity, ensuring accurate arithmetic operations in digital systems.

Technical Specifications

Digital Arithmetic Circuits SN74S381N1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74S381N1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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