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MC14008BDR2G

Onsemi

MC14008BDR2G by Onsemi

MC14008BDR2G by Onsemi is a 4-bit digital arithmetic circuit with 800ns propagation delay. Operating at -55 to 125 °C, it has a supply voltage range of 3-18V. Ideal for military applications due to its CMOS technology and small outline package style.

Median Price

$0.466

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,597 parts In-Stock

1+ parts

$0.610

100+ parts

$0.335

1k+ parts

$0.305

10k+ parts

$0.279

2,597

$0.610

$0.335

$0.305

$0.279

DigiKey

USA . 222 parts In-Stock

1+ parts

$0.610

100+ parts

$0.335

1k+ parts

$0.291

10k+ parts

$0.266

222

$0.610

$0.335

$0.291

$0.266

Rochester

USA . 14,218 parts In-Stock

1+ parts

-

100+ parts

$0.323

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$0.268

10k+ parts

$0.239

14,218

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$0.323

$0.268

$0.239

Verical

USA . 11,574 parts In-Stock

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$0.298

11,574

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$0.298

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Digiode

USA . 922 parts In-Stock

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$0.251

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922

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Vyrian

USA . 79 parts In-Stock

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$0.264

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Flip Electronics

USA . 5,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,000 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,197 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,390 parts In-Stock

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$0.238

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$0.238

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Corohmni

South Africa . 195 parts In-Stock

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$0.264

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195

$0.264

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Problanco Electronics

Mexico . 7,857 parts In-Stock

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TANS Electronics

Latvia . 6,768 parts In-Stock

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SupplyDigital Components

Austria . 6,561 parts In-Stock

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ChipstoGo Electronic ltd

UK . 5,000 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,681 parts In-Stock

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Microchip USA

USA . 3,931 parts In-Stock

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Perfect Parts

USA . 754 parts In-Stock

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754

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Kulean Microsystems

USA . 402 parts In-Stock

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UHIMA Technologies

Türkiye . 180 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Onsemi with the MC14008BDR2G, a top-of-the-line Digital Arithmetic Circuit. Designed for precision and efficiency, this product offers seamless integration into a wide range of applications. From industrial automation to consumer electronics, the MC14008BDR2G delivers exceptional performance and value. Trust in Onsemi's expertise and innovation to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and making assembly more efficient.

No. of Bits: 4

Offers enough precision and flexibility for various digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates efficiently at a standard supply voltage of 5V, ensuring compatibility with typical power sources.

Power Supplies (V): 5/15

Can be powered by either 5V or 15V supplies, providing flexibility in different applications.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Can work in extremely cold conditions, ensuring reliability in a wide range of temperature environments.

Maximum Seated Height: 1.75 mm

Low profile design allows for compact integration in space-constrained applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical connection, making the product durable and suitable for harsh environments.

Technical Specifications

Digital Arithmetic Circuits MC14008BDR2G attributes and parameters. Explore more Digital Arithmetic Circuits devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

800 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC14008BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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