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SN74HC180N-10

Texas Instruments

SN74HC180N-10 by Texas Instruments

SN74HC180N-10 by Texas Instruments is an 8-bit digital arithmetic circuit with a supply voltage of 2-6V. It has a propagation delay of 325ns and operates in industrial temperature range (-40 to 85°C). This IC is commonly used in applications requiring fast arithmetic calculations and precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,890 parts In-Stock

1+ parts

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7,890

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Digiode

USA . 4,407 parts In-Stock

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4,407

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Distributors (Availability)

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Andel Nordic

Denmark . 842 parts In-Stock

1+ parts

$8.826

100+ parts

-

1k+ parts

$8.473

10k+ parts

$8.473

842

$8.826

-

$8.473

$8.473

AZTECH Wire

Italy . 831 parts In-Stock

1+ parts

$19.819

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831

$19.819

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Parana Technologies

USA . 209 parts In-Stock

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$23.136

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$23.773

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209

$23.136

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$23.773

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DigiPath Technology Company

USA . 222 parts In-Stock

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$25.476

100+ parts

$23.438

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-

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222

$25.476

$23.438

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ChromeModa Solutions

Germany . 6,260 parts In-Stock

1+ parts

$25.996

100+ parts

$21.317

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6,260

$25.996

$21.317

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

1+ parts

$25.996

100+ parts

$24.696

1k+ parts

$23.396

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1,275

$25.996

$24.696

$23.396

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One Stop Electronics

USA . 1,547 parts In-Stock

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$60.000

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1,547

$60.000

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Corphita

USA . 505 parts In-Stock

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505

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Overview

Enhance your digital arithmetic circuits with the SN74HC180N-10 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable and efficient solutions for various applications in the electronics industry. This 8-bit device offers customers exceptional value, benefits, and advantages, making it a must-have component for your projects. With its plastic/epoxy package body material and industrial temperature grade, this product ensures superior performance and durability. Upgrade your circuits today with the SN74HC180N-10 and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and insulation, making it suitable for various environments and applications.

No. of Bits: 8

8 bits allow for a wide range of numerical values to be processed, making this product versatile for digital arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration easier.

Propagation Delay (tpd): 325 ns

Low propagation delay of 325 ns ensures fast response times, crucial for real-time digital arithmetic calculations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SN74HC180N-10 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CONFIGURABLE ODD/EVEN PARITY GENERATOR; WITH OPTIONAL 9TH BIT OR PARITY CHECKER INPUT

Family:

HC/UH

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

325 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74HC180N-10 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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