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SN54ALS679J-00

Texas Instruments

SN54ALS679J-00 by Texas Instruments

SN54ALS679J-00 by Texas Instruments is a 12-bit digital arithmetic circuit with a supply voltage of 5V and propagation delay of 35ns. It is used in military-grade applications, featuring inverted output polarity and through-hole terminal form for reliable performance in extreme temperatures from -55 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,914 parts In-Stock

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4,914

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Digiode

USA . 166 parts In-Stock

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166

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Distributors (Availability)

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AZTECH Wire

Italy . 407 parts In-Stock

1+ parts

$8.139

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407

$8.139

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Andel Nordic

Denmark . 958 parts In-Stock

1+ parts

$8.340

100+ parts

-

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$8.007

10k+ parts

$8.007

958

$8.340

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$8.007

$8.007

One Stop Electronics

USA . 515 parts In-Stock

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$22.000

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515

$22.000

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Parana Technologies

USA . 860 parts In-Stock

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$24.066

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$24.720

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860

$24.066

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$24.720

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DigiPath Technology Company

USA . 185 parts In-Stock

1+ parts

$26.500

100+ parts

$24.380

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185

$26.500

$24.380

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ChromeModa Solutions

Germany . 4,619 parts In-Stock

1+ parts

$27.041

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$22.174

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4,619

$27.041

$22.174

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IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$27.041

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$25.689

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$24.337

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1,072

$27.041

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$24.337

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Corphita

USA . 3,090 parts In-Stock

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3,090

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Overview

Elevate your digital arithmetic circuits with the high-quality SN54ALS679J-00 by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments delivers top-notch products that meet and exceed industry expectations. This rectangular package boasts 12 bits of power, making it ideal for a wide range of applications. From military-grade technology to fast propagation delays, this product offers unmatched performance and reliability. Upgrade your designs today with the SN54ALS679J-00 and experience the difference TI can make in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

No. of Bits: 12

High number of bits allows for more precise and accurate calculations, making this product suitable for complex arithmetic operations.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with most power sources.

Propagation Delay (tpd): 35 ns

Low propagation delay ensures quick processing speed, making this product ideal for time-sensitive applications.

Technology: TTL

Uses TTL technology known for its reliability and robustness, ensuring stable performance in various operating conditions.

Technical Specifications

Digital Arithmetic Circuits SN54ALS679J-00 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

WITH INHIBIT

Family:

ALS

JESD-30 Code:

R-GDIP-T20

Length:

24.195 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

12

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

28 mA

Propagation Delay (tpd):

35 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN54ALS679J-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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