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SN74ALS526NP1

Texas Instruments

SN74ALS526NP1 by Texas Instruments

SN74ALS526NP1 by Texas Instruments is a TTL digital arithmetic circuit with 20 terminals in an in-line rectangular package. Operating temperature range of 0-70°C makes it suitable for commercial applications. Its through-hole terminal form and 2.54mm pitch offer reliability in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,811 parts In-Stock

1+ parts

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7,811

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Digiode

USA . 1,392 parts In-Stock

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1,392

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,151 parts In-Stock

1+ parts

$6.805

100+ parts

-

1k+ parts

$6.533

10k+ parts

$6.533

2,151

$6.805

-

$6.533

$6.533

AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$9.102

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750

$9.102

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Parana Technologies

USA . 1,875 parts In-Stock

1+ parts

$15.409

100+ parts

-

1k+ parts

$15.793

10k+ parts

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1,875

$15.409

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$15.793

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DigiPath Technology Company

USA . 866 parts In-Stock

1+ parts

$16.968

100+ parts

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866

$16.968

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$17.314

100+ parts

$16.448

1k+ parts

$15.583

10k+ parts

-

2,378

$17.314

$16.448

$15.583

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ChromeModa Solutions

Germany . 2,094 parts In-Stock

1+ parts

$17.314

100+ parts

$14.197

1k+ parts

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2,094

$17.314

$14.197

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One Stop Electronics

USA . 763 parts In-Stock

1+ parts

$65.000

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763

$65.000

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Corphita

USA . 2,741 parts In-Stock

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2,741

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Overview

Unlock the power of precision and reliability with the SN74ALS526NP1 by Texas Instruments. Crafted with cutting-edge technology and top-notch materials, this digital arithmetic circuit offers unmatched performance and durability in a variety of applications. From industrial automation to telecommunications, this versatile component delivers seamless operation and seamless integration. Trust Texas Instruments to provide you with the quality and value you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices and circuit boards.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for multiple inputs and outputs, enhancing flexibility in circuit design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can operate effectively in a wide range of environments.

Terminal Position: DUAL

Dual terminal positions offer redundancy and increased reliability in the connection points.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications.

Technology: TTL

TTL technology ensures fast switching speeds and compatibility with other TTL components in the circuit.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering during assembly.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy alignment and soldering on standard breadboards and PCBs.

Technical Specifications

Digital Arithmetic Circuits SN74ALS526NP1 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALS526NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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