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SNC54AS280FH

Texas Instruments

SNC54AS280FH by Texas Instruments

SNC54AS280FH by Texas Instruments is a digital arithmetic circuit with TTL technology. It operates at temperatures ranging from -55°C to 125°C, making it suitable for military applications. With a supply voltage of 5V and 20 terminals in a square chip carrier package, it offers reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,317 parts In-Stock

1+ parts

-

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1k+ parts

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4,317

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Vyrian

USA . 2,197 parts In-Stock

1+ parts

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100+ parts

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2,197

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 572 parts In-Stock

1+ parts

$3.015

100+ parts

-

1k+ parts

$2.894

10k+ parts

$2.894

572

$3.015

-

$2.894

$2.894

One Stop Electronics

USA . 1,347 parts In-Stock

1+ parts

$5.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

$5.000

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Parana Technologies

USA . 1,785 parts In-Stock

1+ parts

$16.774

100+ parts

$1,557.705

1k+ parts

$15.096

10k+ parts

-

1,785

$16.774

$1,557.705

$15.096

-

DigiPath Technology Company

USA . 136 parts In-Stock

1+ parts

$18.470

100+ parts

$16.992

1k+ parts

-

10k+ parts

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136

$18.470

$16.992

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IDEA Electronic Components Group

UK . 962 parts In-Stock

1+ parts

$18.847

100+ parts

$17.905

1k+ parts

$16.962

10k+ parts

-

962

$18.847

$17.905

$16.962

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ChromeModa Solutions

Germany . 939 parts In-Stock

1+ parts

$18.847

100+ parts

$15.455

1k+ parts

-

10k+ parts

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939

$18.847

$15.455

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$19.596

100+ parts

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246

$19.596

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Corphita

USA . 3,088 parts In-Stock

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3,088

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Overview

Elevate your digital arithmetic circuits with the SNC54AS280FH by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds industry standards. This versatile chip carrier package is ideal for military-grade applications, offering a wide range of benefits such as high performance, precision, and durability. Upgrade your projects with the SNC54AS280FH and experience the value and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides good thermal conductivity and high resistance to temperature changes, making it a reliable choice for high-performance applications.

Surface Mount: YES

Surface mount technology allows for easy integration into PCBs, saving space and reducing assembly time.

Screening Level: MIL-STD-883 Class B (Modified)

Military standard screening ensures high reliability and quality, suitable for demanding environments.

Nominal Supply Voltage / Vsup: 5V

Operates at a common 5V supply voltage, making it compatible with various systems and easy to power.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures, ideal for applications where reliability under heat stress is critical.

Technology: TTL

Uses TTL technology known for its speed and reliability, making it suitable for fast arithmetic calculations.

Technical Specifications

Digital Arithmetic Circuits SNC54AS280FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883 Class B (Modified)

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SNC54AS280FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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