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SN54LS280FK

Texas Instruments

SN54LS280FK by Texas Instruments

SN54LS280FK by Texas Instruments is a 9-bit digital arithmetic circuit with a propagation delay of 45 ns. It operates at a nominal voltage of 5V and has a load capacitance of 15 pF. This chip carrier package is ideal for military-grade applications requiring fast computation speeds in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,938 parts In-Stock

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Digiode

USA . 1,379 parts In-Stock

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1,379

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Distributors (Availability)

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AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$11.994

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255

$11.994

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Parana Technologies

USA . 1,764 parts In-Stock

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$25.647

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-

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$26.251

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1,764

$25.647

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$26.251

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DigiPath Technology Company

USA . 1,125 parts In-Stock

1+ parts

$28.241

100+ parts

$25.981

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1,125

$28.241

$25.981

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ChromeModa Solutions

Germany . 2,713 parts In-Stock

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$28.817

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$23.630

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2,713

$28.817

$23.630

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$28.817

100+ parts

$27.376

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$25.935

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709

$28.817

$27.376

$25.935

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One Stop Electronics

USA . 420 parts In-Stock

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$40.000

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420

$40.000

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Corphita

USA . 825 parts In-Stock

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Overview

Unlock the power of precision with the Texas Instruments SN54LS280FK digital arithmetic circuit. Manufactured with top-quality materials and cutting-edge technology, this product offers unmatched performance in a compact chip carrier package. Ideal for a wide range of applications, this 9-bit device delivers lightning-fast propagation delay and reliable output polarity. Trust Texas Instruments to provide you with the tools you need to succeed in your next project. Experience the value and benefits of the SN54LS280FK today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and reliability, making this product suitable for harsh operating environments.

No. of Bits: 9

Having 9 bits allows for more precision and accuracy in arithmetic calculations, making this product ideal for applications that require high resolution.

Propagation Delay (tpd): 45 ns

The low propagation delay ensures fast processing speeds, making this product efficient for time-sensitive operations.

Temperature Grade: MILITARY

Being designed for military-grade applications, this product offers high performance and reliability in extreme temperature conditions.

Technology: TTL

TTL technology provides high-speed operation and low power consumption, making this product efficient and reliable for digital arithmetic circuits.

Technical Specifications

Digital Arithmetic Circuits SN54LS280FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

LS

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay (tpd):

45 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.89 mm

Trade Compliance

SN54LS280FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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