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SN74AS182FN3

Texas Instruments

SN74AS182FN3 by Texas Instruments

SN74AS182FN3 by Texas Instruments is a TTL digital arithmetic circuit in a 20-terminal chip carrier package. Operating temperature range of 0-70°C, it's surface-mountable and has J-bend terminals with 1.27mm pitch. Ideal for commercial applications requiring precise arithmetic calculations in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,453 parts In-Stock

1+ parts

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7,453

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Digiode

USA . 1,334 parts In-Stock

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1,334

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,113 parts In-Stock

1+ parts

$6.703

100+ parts

-

1k+ parts

$6.435

10k+ parts

$6.435

5,113

$6.703

-

$6.435

$6.435

AZTECH Wire

Italy . 799 parts In-Stock

1+ parts

$13.471

100+ parts

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799

$13.471

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One Stop Electronics

USA . 756 parts In-Stock

1+ parts

$18.000

100+ parts

-

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756

$18.000

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Parana Technologies

USA . 48 parts In-Stock

1+ parts

$22.181

100+ parts

-

1k+ parts

$22.822

10k+ parts

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48

$22.181

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$22.822

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DigiPath Technology Company

USA . 702 parts In-Stock

1+ parts

$24.425

100+ parts

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702

$24.425

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IDEA Electronic Components Group

UK . 2,087 parts In-Stock

1+ parts

$24.923

100+ parts

$23.677

1k+ parts

$22.431

10k+ parts

-

2,087

$24.923

$23.677

$22.431

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ChromeModa Solutions

Germany . 1,919 parts In-Stock

1+ parts

$24.923

100+ parts

$20.437

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1,919

$24.923

$20.437

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Corphita

USA . 2,157 parts In-Stock

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2,157

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Overview

Unlock the power of digital arithmetic circuits with the SN74AS182FN3 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in a compact chip carrier package. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. Whether you're designing complex mathematical algorithms or implementing data processing functions, the SN74AS182FN3 provides the performance and efficiency you need to stay ahead in today's competitive market. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

The square package shape provides a more compact design, saving space on the PCB and allowing for dense circuit integration.

No. of Terminals: 20

The high number of terminals allows for complex arithmetic operations to be conducted efficiently, making the product suitable for advanced digital applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures the product can withstand demanding operational conditions without risk of damage or performance degradation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively even in colder environments, increasing its versatility.

Terminal Position: QUAD

The quad terminal position allows for easy connectivity to external components or devices, facilitating integration into larger systems.

Technology: TTL

The use of TTL technology ensures fast and reliable digital signal processing, making the product suitable for high-speed arithmetic calculations.

Terminal Form: J BEND

The J bend terminal form offers secure and reliable connections to the PCB, reducing the risk of signal loss or interference in operation.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close proximity of terminals, enabling better signal integrity and reducing signal delay in data transmission.

Technical Specifications

Digital Arithmetic Circuits SN74AS182FN3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74AS182FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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