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SN74HC680N3

Texas Instruments

SN74HC680N3 by Texas Instruments

SN74HC680N3 by Texas Instruments is a CMOS digital arithmetic circuit with 20 terminals. Operating temperature ranges from -40 to 85°C, suitable for industrial use. The rectangular package style is made of plastic/epoxy and has a terminal pitch of 2.54mm, ideal for various electronic applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,851 parts In-Stock

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Digiode

USA . 4,979 parts In-Stock

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4,979

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Distributors (Availability)

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Andel Nordic

Denmark . 79 parts In-Stock

1+ parts

$4.103

100+ parts

-

1k+ parts

$3.939

10k+ parts

$3.939

79

$4.103

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$3.939

$3.939

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$8.384

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857

$8.384

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Parana Technologies

USA . 766 parts In-Stock

1+ parts

$22.890

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$23.551

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766

$22.890

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$23.551

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DigiPath Technology Company

USA . 1,407 parts In-Stock

1+ parts

$25.205

100+ parts

$23.188

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1,407

$25.205

$23.188

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ChromeModa Solutions

Germany . 4,021 parts In-Stock

1+ parts

$25.719

100+ parts

$21.090

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4,021

$25.719

$21.090

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IDEA Electronic Components Group

UK . 1,133 parts In-Stock

1+ parts

$25.719

100+ parts

$24.433

1k+ parts

$23.147

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1,133

$25.719

$24.433

$23.147

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One Stop Electronics

USA . 413 parts In-Stock

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$32.000

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413

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Corphita

USA . 3,640 parts In-Stock

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3,640

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Overview

Elevate your digital arithmetic circuits with the SN74HC680N3 by Texas Instruments. Designed with precision and quality in mind, this product offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile component delivers exceptional value and benefits to customers looking for efficiency and innovation. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability to the product, making it suitable for long-term usage.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in various electronic systems.

No. of Terminals: 20

Having 20 terminals allows for complex digital arithmetic operations to be performed efficiently.

Package Style (Meter): IN-LINE

The in-line package style enables easy connectivity and installation in different circuit setups.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can function effectively even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product remains operational in extreme cold conditions as well.

Terminal Position: DUAL

The dual terminal position provides flexibility in connection and ease of use in various circuit configurations.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that this product can meet the reliability and performance requirements of industrial applications.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high-speed operation, making it an efficient choice for digital arithmetic circuits.

Terminal Form: THROUGH-HOLE

The through-hole terminal form facilitates secure mounting on PCBs and offers robust connections for reliable circuit performance.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy connection and compatibility with various prototyping and production boards.

Technical Specifications

Digital Arithmetic Circuits SN74HC680N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74HC680N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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