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SN54AS264FH

Texas Instruments

SN54AS264FH by Texas Instruments

SN54AS264FH by Texas Instruments is a digital arithmetic circuit in a ceramic chip carrier package. Operating temperature ranges from -55°C to 125°C, suitable for military-grade applications. Features TTL technology with 20 terminals and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,396 parts In-Stock

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Digiode

USA . 4,923 parts In-Stock

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4,923

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Distributors (Availability)

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Andel Nordic

Denmark . 1,947 parts In-Stock

1+ parts

$3.412

100+ parts

-

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$3.276

10k+ parts

$3.276

1,947

$3.412

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$3.276

$3.276

AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$19.715

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422

$19.715

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Parana Technologies

USA . 694 parts In-Stock

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$29.227

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$57.024

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694

$29.227

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$57.024

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DigiPath Technology Company

USA . 418 parts In-Stock

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$32.182

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418

$32.182

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ChromeModa Solutions

Germany . 6,662 parts In-Stock

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$32.839

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$26.928

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6,662

$32.839

$26.928

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IDEA Electronic Components Group

UK . 1,028 parts In-Stock

1+ parts

$32.839

100+ parts

$31.197

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$29.555

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1,028

$32.839

$31.197

$29.555

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One Stop Electronics

USA . 826 parts In-Stock

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$50.000

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826

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Corphita

USA . 1,113 parts In-Stock

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Overview

Upgrade your digital arithmetic circuits with the superior quality and reliability of the Texas Instruments SN54AS264FH. This high-performance chip carrier package boasts military-grade temperature tolerance and TTL technology, making it ideal for demanding applications. With 20 terminals and a ceramic body, this square-shaped device offers unmatched durability and precision. Trust in Texas Instruments to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the SN54AS264FH today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal conductivity, which helps in dissipating heat efficiently, making the product reliable for extended use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, reducing assembly time and cost.

Package Shape: SQUARE

Square package shape provides uniformity in design and allows for easy placement on the circuit board, enhancing overall aesthetics and functionality.

No. of Terminals: 20

Having 20 terminals allows for increased connectivity options and versatility in circuit design, providing more flexibility in configuration.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compactness and protection to the internal components, ensuring durability and reliability in demanding applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme conditions without compromising performance, making it suitable for a wide range of environments.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes the product suitable for use in cold environments, ensuring consistent performance in various conditions.

Terminal Position: QUAD

Quad terminal position enables efficient connectivity and signal transmission, contributing to improved speed and accuracy in data processing.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and stability in harsh environments, making the product ideal for mission-critical applications.

Technology: TTL

TTL technology offers high-speed operation and low power consumption, making the product energy-efficient and suitable for applications requiring fast processing.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination, ensuring safety and compliance with environmental regulations.

Terminal Pitch: 1.27 mm

With a small terminal pitch, the product allows for high-density mounting on circuit boards, optimizing space utilization and enhancing overall system performance.

Technical Specifications

Digital Arithmetic Circuits SN54AS264FH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN54AS264FH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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