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CD40147BMTG4

Texas Instruments

CD40147BMTG4 by Texas Instruments

CD40147BMTG4 by Texas Instruments is a digital arithmetic circuit with 10-bit resolution. It operates at a nominal voltage of 5V and has a propagation delay of 900ns. This versatile component is commonly used in military-grade applications due to its small outline package and high temperature tolerance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,682 parts In-Stock

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3,682

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Digiode

USA . 3,503 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Andel Nordic

Denmark . 4,886 parts In-Stock

1+ parts

$5.666

100+ parts

-

1k+ parts

$5.439

10k+ parts

$5.439

4,886

$5.666

-

$5.439

$5.439

AZTECH Wire

Italy . 675 parts In-Stock

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$7.033

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675

$7.033

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Corohmni

South Africa . 101 parts In-Stock

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$17.580

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101

$17.580

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Parana Technologies

USA . 2,209 parts In-Stock

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$27.248

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$33.660

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2,209

$27.248

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$33.660

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DigiPath Technology Company

USA . 276 parts In-Stock

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$30.004

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276

$30.004

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IDEA Electronic Components Group

UK . 1,264 parts In-Stock

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$30.616

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$29.085

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$27.554

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1,264

$30.616

$29.085

$27.554

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ChromeModa Solutions

Germany . 342 parts In-Stock

1+ parts

$30.616

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$25.105

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342

$30.616

$25.105

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One Stop Electronics

USA . 863 parts In-Stock

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$33.000

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863

$33.000

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Ampacity Inc.

Singapore . 1,580 parts In-Stock

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$46.000

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1,580

$46.000

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Continental Prestige Electronics

USA . 6,047 parts In-Stock

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Corphita

USA . 2,911 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,720 parts In-Stock

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Overview

Experience the next level of digital arithmetic circuits with the CD40147BMTG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The CD40147BMTG4 offers unparalleled precision and efficiency, making it the ideal choice for a wide range of applications. With its compact design and surface mount capability, this product is both versatile and convenient. Whether you're working on industrial automation, automotive systems, or consumer electronics, the CD40147BMTG4 delivers exceptional performance every time. Trust in Texas Instruments to bring you cutting-edge technology that exceeds your expectations. Elevate your projects with the CD40147BMTG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to harsh environmental conditions, making this product ideal for rugged applications.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, enabling seamless integration and reducing assembly time.

No. of Functions: 1

With a single function, this product simplifies circuit design and reduces complexity, making it suitable for applications that require straightforward digital arithmetic operations.

Package Shape: RECTANGULAR

The rectangular package shape provides space-saving benefits and allows for efficient usage of board space, making it an efficient choice for designs with limited real estate.

No. of Bits: 10

This product offers a wide range of bit options, allowing for precise and accurate calculations, making it suitable for applications that require high precision arithmetic operations.

Nominal Supply Voltage/Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power systems, making it easy to integrate into existing circuits.

Power Supplies (V): 5/15

The availability of multiple power supply options (5V and 15V) provides flexibility in design and allows customization according to specific application requirements.

No. of Terminals: 16

With 16 terminals, this product allows for easy connectivity and compatibility with a variety of electronic systems, enhancing its versatility and applicability.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness, making it suitable for space-constrained applications and enabling designs with reduced footprint.

Propagation Delay (tpd): 900 ns

The relatively low propagation delay of 900ns ensures fast and efficient arithmetic operations, making this product ideal for time-critical applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables reliable performance in demanding environments, expanding the product's range of applications.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this product is built to withstand extreme cold conditions, ensuring reliable operation in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring long-term reliability and electrical performance.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit board layout and installation, providing options for different design configurations.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm contributes to compact designs and facilitates miniaturization of electronic devices.

Width: 3.9 mm

With a width of 3.9mm, this product offers space-efficient dimensions, allowing for optimized board layout and enabling designs with reduced size.

Output Polarity: INVERTED

The inverted output polarity feature provides configuration options for different system requirements, enhancing compatibility and ease of integration with other components.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3V ensures flexibility and compatibility with a wide range of power sources, expanding the product's utility.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand a maximum time of 30 seconds at peak reflow temperature during soldering ensures reliable and secure connections, simplifying the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, making it suitable for industrial manufacturing applications.

Length: 9.9 mm

The length of 9.9mm contributes to compact designs and optimized board layout, allowing for efficient space utilization in electronic systems.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product offers exceptional reliability and performance in harsh operating conditions, making it ideal for defense and aerospace applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high integration capabilities, making this product energy-efficient and suitable for portable devices and power-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and robustness during handling and soldering, offering enhanced reliability and ease of assembly.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product allows for easy connection and compatibility with standard PCB layouts, simplifying the integration process.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level of 1 indicates that this product has a low sensitivity to moisture, ensuring stable and reliable performance even in humid environments.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18V allows for versatile operation across a wide range of power systems, making this product suitable for various industrial applications.

Technical Specifications

Digital Arithmetic Circuits CD40147BMTG4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

900 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD40147BMTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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