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CD40147BH

Texas Instruments

CD40147BH by Texas Instruments

CD40147BH by Texas Instruments is a 10-bit digital arithmetic circuit with inverted output polarity. It operates in a temperature range of -55 to 125°C and supports a supply voltage from 3V to 18V. This CMOS technology chip has a propagation delay of 900ns, making it ideal for military-grade applications requiring precise calculations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,450 parts In-Stock

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2,450

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Digiode

USA . 983 parts In-Stock

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983

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Distributors (Availability)

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Native Components

USA . 1,341 parts In-Stock

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$0.847

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$0.847

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Northwest PG Solutions

USA . 2,343 parts In-Stock

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$0.932

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2,343

$0.932

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AZTECH Wire

Italy . 772 parts In-Stock

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$7.584

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772

$7.584

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Andel Nordic

Denmark . 138 parts In-Stock

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$9.534

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$9.153

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$9.153

138

$9.534

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$9.153

$9.153

Parana Technologies

USA . 1,986 parts In-Stock

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$24.776

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$25.450

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1,986

$24.776

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$25.450

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ChromeModa Solutions

Germany . 4,786 parts In-Stock

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$27.838

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$22.827

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4,786

$27.838

$22.827

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IDEA Electronic Components Group

UK . 141 parts In-Stock

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$27.838

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$26.446

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$25.054

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141

$27.838

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$25.054

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One Stop Electronics

USA . 758 parts In-Stock

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$61.000

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Corphita

USA . 3,038 parts In-Stock

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Supply Digital

USA . 833 parts In-Stock

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DigiPath Technology Company

USA . 364 parts In-Stock

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$25.099

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364

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$25.099

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Overview

Unlock the power of digital arithmetic circuits with the CD40147BH from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. Ideal for military-grade applications, this 10-bit chip offers inverted output polarity and a fast propagation delay of 900 ns. With a wide operating temperature range and a compact rectangular package, the CD40147BH provides unmatched value and performance. Trust Texas Instruments for all your digital arithmetic circuit needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient mounting on circuit boards, saving space and simplifying assembly.

No. of Bits: 10

With a higher number of bits, this digital arithmetic circuit can handle more complex computations and provide more precise results.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides compatibility with standard logic levels and power sources.

Propagation Delay (tpd): 900 ns

The relatively low propagation delay ensures fast processing speed and efficient operation of the circuit.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity, ideal for digital circuits.

Technical Specifications

Digital Arithmetic Circuits CD40147BH attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

10 TO 4 LINE PRIORITY ENCODER

Family:

4000/14000/40000

JESD-30 Code:

R-XUUC-N16

Logic IC Type:

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Propagation Delay (tpd):

900 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

CD40147BH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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