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SN74F286N3

Texas Instruments

SN74F286N3 by Texas Instruments

SN74F286N3 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals in an in-line rectangular package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring dual terminal positions. The package body material is plastic/epoxy with a terminal pitch of 2.54mm, ideal for various electronic projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,936 parts In-Stock

1+ parts

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7,936

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Digiode

USA . 4,858 parts In-Stock

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4,858

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,947 parts In-Stock

1+ parts

$3.216

100+ parts

-

1k+ parts

$3.088

10k+ parts

$3.088

2,947

$3.216

-

$3.088

$3.088

One Stop Electronics

USA . 1,308 parts In-Stock

1+ parts

$11.000

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1,308

$11.000

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AZTECH Wire

Italy . 544 parts In-Stock

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$11.814

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544

$11.814

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Parana Technologies

USA . 1,975 parts In-Stock

1+ parts

$21.227

100+ parts

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1k+ parts

$21.527

10k+ parts

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1,975

$21.227

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$21.527

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DigiPath Technology Company

USA . 1,651 parts In-Stock

1+ parts

$23.374

100+ parts

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1,651

$23.374

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ChromeModa Solutions

Germany . 4,703 parts In-Stock

1+ parts

$23.851

100+ parts

$19.558

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4,703

$23.851

$19.558

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IDEA Electronic Components Group

UK . 498 parts In-Stock

1+ parts

$23.851

100+ parts

$22.658

1k+ parts

$21.466

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498

$23.851

$22.658

$21.466

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Corphita

USA . 2,808 parts In-Stock

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2,808

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Overview

Experience the cutting-edge technology of Texas Instruments with the SN74F286N3 digital arithmetic circuit. This high-quality product offers unmatched precision and reliability, making it a must-have for any electronic project. Whether you're working on robotics, automation, or telecommunications, this versatile component will streamline your design process and deliver exceptional results. Trust in Texas Instruments to provide top-of-the-line solutions that exceed expectations. Elevate your projects with the SN74F286N3 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuits and systems, making it versatile and easy to work with.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting the product to other components and peripherals, allowing for a wide range of applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to incorporate the product into existing systems or designs, improving efficiency and ease of use.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the product can function reliably in a variety of environments without overheating or malfunctioning.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature means the product can operate effectively even in colder environments, providing flexibility in usage.

Terminal Position: DUAL

The dual terminal position allows for more secure connections and reduces the risk of disconnection or signal loss, improving overall performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard commercial applications, providing cost-effective solutions for various industries.

Technology: TTL

The TTL technology ensures fast and reliable signal processing, making the product suitable for high-speed applications where accuracy and speed are crucial.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and secure connections, reducing the risk of signal loss or disconnection during operation.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch provides compatibility with standard PCB layouts and components, making it easy to integrate the product into existing designs or systems.

Technical Specifications

Digital Arithmetic Circuits SN74F286N3 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74F286N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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