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CD40147BF

Texas Instruments

CD40147BF by Texas Instruments

CD40147BF by Texas Instruments is a 10-bit digital arithmetic circuit with 900 ns propagation delay. Operating b/w -55 to 125 °C, it has a supply voltage range of 3-18 V and MILITARY temperature grade. Ideal for applications requiring precise arithmetic calculations in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Digiode

USA . 5,038 parts In-Stock

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Vyrian

USA . 4,368 parts In-Stock

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Anansix

USA . 911 parts In-Stock

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ComSIT Distribution GmbH

Germany . 500 parts In-Stock

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500

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LWI Electronics Inc

India . 178 parts In-Stock

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Electronic Expediters

USA . 11 parts In-Stock

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Native Components

USA . 714 parts In-Stock

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$0.343

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$0.329

714

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Northwest PG Solutions

USA . 1,134 parts In-Stock

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$0.377

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$0.332

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One Stop Electronics

USA . 1,553 parts In-Stock

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$9.000

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AZTECH Wire

Italy . 796 parts In-Stock

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$18.421

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Parana Technologies

USA . 1,240 parts In-Stock

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$20.668

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$20.784

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DigiPath Technology Company

USA . 1,415 parts In-Stock

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$22.759

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$20.938

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ChromeModa Solutions

Germany . 2,706 parts In-Stock

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$23.223

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$19.043

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IDEA Electronic Components Group

UK . 1,821 parts In-Stock

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$22.062

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$20.901

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Andel Nordic

Denmark . 4,771 parts In-Stock

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$48.960

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$34.274

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Corphita

USA . 3,557 parts In-Stock

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Supply Digital

USA . 2,437 parts In-Stock

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Kepictronics

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Overview

Unlock the power of digital arithmetic circuits with the CD40147BF by Texas Instruments. With a reputation for high-quality manufacturing, Texas Instruments delivers a reliable and durable product that exceeds industry standards. This versatile device, housed in a ceramic, glass-sealed package, is perfect for a wide range of applications. From military-grade projects to commercial endeavors, the CD40147BF offers unparalleled performance and efficiency. Trust Texas Instruments for cutting-edge technology and unmatched value in digital arithmetic circuits. Step up your game with the CD40147BF today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material provides durability and protection for the digital arithmetic circuit, ensuring long-term reliability.

No. of Bits: 10

Being a 10-bit digital arithmetic circuit, it offers high precision for calculations and data processing.

Propagation Delay (tpd): 900 ns

With a low propagation delay of 900 ns, this circuit can quickly process data and perform calculations efficiently.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures that the circuit can function reliably in various environmental conditions.

Technology: CMOS

Using CMOS technology, this digital arithmetic circuit offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits CD40147BF attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

10 TO 4 LINE PRIORITY ENCODER

Family:

4000/14000/40000

JESD-30 Code:

R-GDIP-T16

Logic IC Type:

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay (tpd):

900 ns

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

CD40147BF Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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