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CD74HC688M96E4

Texas Instruments

CD74HC688M96E4 by Texas Instruments

CD74HC688M96E4 by Texas Instruments is an 8-bit digital arithmetic circuit with a propagation delay of 36ns at 4.5V supply, suitable for military-grade applications. It features inverted output polarity, operates b/w -55 to 125°C, and has a max power supply current of 0.08mA.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 6,122 parts In-Stock

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Digiode

USA . 520 parts In-Stock

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Northwest PG Solutions

USA . 1,871 parts In-Stock

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$2.413

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AZTECH Wire

Italy . 725 parts In-Stock

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$5.388

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Parana Technologies

USA . 1,728 parts In-Stock

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$13.323

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$13.833

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DigiPath Technology Company

USA . 301 parts In-Stock

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$14.970

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$14.222

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$13.473

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ChromeModa Solutions

Germany . 1,178 parts In-Stock

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$12.275

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One Stop Electronics

USA . 450 parts In-Stock

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Component Stockers USA

USA . 716 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,578 parts In-Stock

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Corphita

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Microchip USA

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Native Components

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Andel Nordic

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Overview

Experience the superior quality and reliability of Texas Instruments with the CD74HC688M96E4 digital arithmetic circuit. This product offers customers a high-performance solution for various applications, thanks to its innovative technology and military-grade temperature grade. With fast propagation delay and inverted output polarity, this product ensures efficient operation and precise results. Trust Texas Instruments to deliver top-notch products that exceed expectations and bring value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package offers good electrical insulation properties and is cost-effective.

Propagation Delay At Nominal Supply: 36 ns

Low propagation delay ensures fast processing speed, making it suitable for real-time applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

No. of Bits: 8

8-bit resolution provides a wide range of numerical values for processing digital data.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a standard supply voltage, ensuring compatibility with common power sources.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving overall efficiency of the circuit.

Technical Specifications

Digital Arithmetic Circuits CD74HC688M96E4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

255 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CD74HC688M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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