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CD4063BPWR

Texas Instruments

CD4063BPWR by Texas Instruments

CD4063BPWR by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 1250 ns. Operating b/w -55 to 125 °C, it has a supply voltage range of 3-18 V and comes in a small outline package. Ideal for military-grade applications requiring true output polarity and CMOS technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 8,008 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Digiode

USA . 52 parts In-Stock

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AZTECH Wire

Italy . 431 parts In-Stock

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$5.571

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Corohmni

South Africa . 56 parts In-Stock

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$16.716

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Parana Technologies

USA . 10 parts In-Stock

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$17.775

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DigiPath Technology Company

USA . 1,583 parts In-Stock

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$19.573

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ChromeModa Solutions

Germany . 5,719 parts In-Stock

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$19.972

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$16.377

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IDEA Electronic Components Group

UK . 275 parts In-Stock

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$18.973

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$17.975

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One Stop Electronics

USA . 1,378 parts In-Stock

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$22.000

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Ampacity Inc.

Singapore . 808 parts In-Stock

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Argo Parts USA

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 3,372 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the Texas Instruments CD4063BPWR, a top-of-the-line digital arithmetic circuit designed to exceed your expectations. With a focus on innovation and precision engineering, Texas Instruments delivers cutting-edge solutions for a wide range of applications. This product offers exceptional value and benefits, providing customers with a seamless and efficient user experience. Experience the advantages of this high-performance circuit and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards

No. of Bits: 4

Suitable for applications requiring 4-bit digital arithmetic calculations

Nominal Supply Voltage: 5V

Works efficiently with a 5V power supply, a common voltage in electronic devices

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the performance of the product

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without performance degradation

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions without issues

Propagation Delay: 1250 ns

Fast propagation delay ensures quick calculations and responses

Technical Specifications

Digital Arithmetic Circuits CD4063BPWR attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Propagation Delay (tpd):

1250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

CD4063BPWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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