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CD4063BEE4

Texas Instruments

CD4063BEE4 by Texas Instruments

CD4063BEE4 by Texas Instruments is a 4-bit digital arithmetic circuit with a propagation delay of 500 ns at 5V. It operates in a temperature range from -55 to 125°C and has a max power supply current of 0.3 mA. Ideal for military-grade applications requiring accurate arithmetic calculations in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,017 parts In-Stock

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Digiode

USA . 2,934 parts In-Stock

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2,934

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Andel Nordic

Denmark . 462 parts In-Stock

1+ parts

$2.396

100+ parts

-

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$2.300

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$2.300

462

$2.396

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$2.300

$2.300

Native Components

USA . 678 parts In-Stock

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$8.100

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678

$8.100

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Northwest PG Solutions

USA . 230 parts In-Stock

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$8.910

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$8.019

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230

$8.910

$8.019

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AZTECH Wire

Italy . 740 parts In-Stock

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$11.297

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740

$11.297

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Parana Technologies

USA . 90 parts In-Stock

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$23.726

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$24.356

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90

$23.726

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$24.356

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ChromeModa Solutions

Germany . 5,559 parts In-Stock

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$26.658

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$21.860

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$26.658

$21.860

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IDEA Electronic Components Group

UK . 2,279 parts In-Stock

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$26.658

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$25.325

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$23.992

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$23.992

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One Stop Electronics

USA . 1,109 parts In-Stock

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$36.000

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Corphita

USA . 3,342 parts In-Stock

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DigiPath Technology Company

USA . 991 parts In-Stock

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$24.035

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$24.035

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the CD4063BEE4, a top-of-the-line digital arithmetic circuit that promises exceptional performance in various applications. Whether you're looking to upgrade your electronic devices or enhance your projects, this product offers unmatched value, precision, and efficiency. With Texas Instruments' reputation for excellence backing it up, the CD4063BEE4 ensures seamless operation and optimal results, making it the ideal choice for all your digital arithmetic circuit needs. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the internal components of the digital arithmetic circuit.

Propagation Delay At Nominal Supply: 500 ns

Low propagation delay ensures fast operation and efficient performance of the circuit.

No. of Bits: 4

Having 4 bits allows for a wide range of digital arithmetic calculations, making the circuit versatile and suitable for various applications.

Nominal Supply Voltage / Vsup: 5V

Operating at a nominal supply voltage of 5V makes the circuit compatible with standard power sources and ensures stability in operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this circuit can withstand high temperature environments, making it suitable for industrial and military applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making the circuit efficient and reliable in various operating conditions.

Technical Specifications

Digital Arithmetic Circuits CD4063BEE4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.3 mA

Propagation Delay At Nominal Supply:

500 ns

Propagation Delay (tpd):

1250 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD4063BEE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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